Amazon Technologies, Inc.

Robert Olson

Bradley David Urban

Troy Hulick

Matthew Michael Seflic

Jung Sik Yang

Albert John Yu Sam Chua

Angeles Marcia Almanza-Workman

Shelomon Patrick Doblack

Edward Albert Liljegren

Christopher Lorenzo Dunn

Marcus-Alan Gilbert

Kenneth James Albanowski

Aviv Shoval

Manuel Rosendo Arana Manzano

Christopher John Kraeutle

William James Carter-Giannini

Adam Kenneth Cybart

Ryan Michael Fleming

Eduardo Bezerra Valentin

Anna Kim Lee

Gaurav Soni

David Joseph Derrick

Daniel Jones

Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device.

Unibody thermal enclosure

Various examples are directed to providing thermal management to a computing device. The computing device may receive temperature state data describing a temperature state of the computing device. The temperature state may comprise a first temperature value at a first location at the computing device. The computing device may also receive use state data describing a first use state of the computing device. The first use state may comprise an initial operating condition of a first component of the computing device and an initial operating condition of a second component of the computing device. The computing device may determine that at least one temperature value at the computing device is out-of-range and select a second use state for the computing device. The second use state may comprise at least one of a new operating condition for the first component or a new operating condition of the second component.

System level thermal management

A force-sensitive resistor (FSR) assembly includes first and second electrically insulative substrates. The first substrate includes a first top surface and a first bottom surface. The second substrate includes a second top surface and a second bottom surface. The first substrate is positioned such that the first bottom surface is disposed facing the second top surface. The FSR assembly also includes thermoset ink disposed between the first substrate and the second substrate.

Force-sensitive resistor assemblies and methods

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Sunnyvale, CA, United States of America

Robert Olson