Motorola Corporation

Robert O Wagner

Richard T Ida

Samuel L Coffman

Joel Robert Gibson

Michael R Shields

Scott D McCall

Daniel L Ziegler

An overvoltage protection device (40) and a method for increasing the overvoltage current the device can carry. The overvoltage protection device (40) includes a Silicon Controlled Rectifier (SCR) (11) and an SCR enhance circuit (42). The SCR enhance circuit (42) provides the SCR (11) with an additional low resistance path to increase the amount of overvoltage shunt current the SCR (11) carries during an overvoltage event.

Overvoltage protection device and method for increasing shunt current

An electronic device (100) has a heatsink (116) and electrical contacts (120) which are originally all part of a support frame (200). After assembly, the border of the support frame (202) is broken off, thereby electrically isolating the electrical contacts (120) from one another, and from the heatsink (116). The electrical contacts (120) and the heatsink (116) are coplanar. In one version, the electrical contacts (120) do not extend past the circuit board (102) of the device (100).

Electronic device having coplanar heatsink and electrical contacts

A substantially planar insulating sheet of high temperature printed circuit board material (11) is used to form a leadframe strip (18, 19, 21) for a semiconductor package (20). The leadframe strip (18, 19, 21) includes a die attach opening (12) through the insulating sheet (11). A plurality of metallized areas (13, 22, 23) on the insulating sheet (11) form bonding pads (13) and package leads (22). Conductive holes (14) electrically connect the bonding pads (13) and the package leads (22).

Leadframe strip for semiconductor packages and method

An end terminated high power chip resistor-printed circuit board assembly (9) suitable for use in applications requiring miniature surface mount resistors capable of high power dissipation. An end terminated high power chip resistor (8) is constructed by coating a portion of the bottom of an end terminated chip resistor with a conductive plate (12). The end terminated high power chip resistor (8) is mounted to a printed circuit board having at least one via (23) lined with metal (20) wherein the conductive plate (12) is positioned above the via (23) lined with metal (20). A heat sink (16) is mounted to the printed circuit board opposite to the side to which the end terminated high power chip resistor (8) is mounted and is in contact with the metal (20) lining via (23).

End terminated high power chip resistor assembly

A method for selectively controlling the plating thickness on opposing sides of a body is disclosed. The method comprises providing an assembly of the body to be plated, a shield having apertures therein and a sealing member between body to be plated and the shield. The sealing member has an opening to allow plating solution to reach one surface of the body to be plated and has further openings to allow gases and depleted solution to escape from the assembly. The process provides a thinner layer of plated metal on the inner surface of the body to be plated and a thicker layer in the outer surface. It is particularly useful in plating ceramic circuit boards.

Growing community of inventors

Austin, TX, United States of America

Robert O Wagner