Seasonal Specialties, LLC

Automated Assembly Corporation

Other

Robert Neuman

Steven J Altamura

David Raymond Neuman

Scott Lindblad

Dennis Wang

Michael B Lasky

Kimmo Kyllonen

Jahn Stopperan

Pat Connolly

Brian Backes

A disclosed circuit arrangement includes adhesive transfer tape, and an electronic device attached to adhesive of the adhesive transfer tape. First and second cross wires are attached to the adhesive and are disposed proximate the electronic device. One or more wire segments are attached to the adhesive and have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments have round cross sections, the first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. First and second bond wires are connected to the electronic device and to the first and second portions of the one or more wire segments, respectively.

Wire bonded electronic devices to round wire

A disclosed circuit arrangement includes an adhesive layer on a water soluble backing, antenna wire adhered to the adhesive layer, an RF transponder disposed on the adhesive layer, and first and second cross wires attached to the adhesive layer and disposed proximate the RF transponder. The antenna wire has first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire. The first and second cross wires and the antenna wire have round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the RF transponder and to the first portion of the antenna wire, and a second bond wire is connected to the RF transponder and to the second portion of the antenna wire.

Transponder wire bonded to round wire on adhesive tape having a water-soluble backing

A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.

Guide posts for wire bonding

The disclosed transponder arrangement includes adhesive transfer tape and an RF transponder. The adhesive transfer tape includes an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. An antenna is adhered directly to the adhesive layer, and an RF transponder is disposed on the adhesive layer and coupled to the antenna.

RF transponder on adhesive transfer tape

A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and solid state lighting elements are disposed on the adhesive layer and coupled to the power wires.

Solid-state lighting elements on adhesive transfer tape

A disclosed circuit arrangement includes adhesive transfer tape having a layer of pressure sensitive adhesive (PSA) having a first major surface and a second major surface opposite the first major surface. One or more metal foil pads are attached directly to the second major surface of the layer of PSA. Electrically conductive round wire is attached directly to the second major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly to the second major surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

A disclosed transponder arrangement includes a water soluble backing having first and second major surfaces. A layer of pressure sensitive adhesive (PSA) has a third major surface and a fourth major surface. The fourth major surface is directly adhered to the first major surface of the water soluble backing. One or more metal foil pads are attached directly on the third major surface of the layer of PSA. Electrically conductive round wire is attached directly on the third major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the metal foil pad(s) with weld joint(s). An RF transponder is attached directly on the third major surface of the first layer of PSA and is electrically connected to the one or more portions of the round wire by bond wire(s).

A light unit includes a bulb having a light source with lead wires and a separator, a switch member that includes a support member and a pair of spring terminals, and a socket having two or more conductive terminals and adapted to receive the bulb and the switch member. The switch member is adapted to cause the pair of spring terminals to contact one another to form an electrical short circuit across the pair of conductive terminals and the light source when the bulb is completely or partially removed from the socket. The lead wires form an electrical connection across the conductive terminals and the separator breaks contact between the pair of spring terminals when the bulb is seated in the socket.

Mechanical bypass light unit

A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.

Attaching wire to a layer of adhesive

A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.

A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.

Wire bonded IC components to round wire

The disclosed lighting arrangement includes adhesive transfer tape. The adhesive transfer tape has an adhesive layer disposed directly on a release liner, and the release liner is separable from the adhesive layer. Power wires are adhered directly to the adhesive layer, and one or more light-emitting diodes (LEDs) are disposed on the adhesive layer and coupled to the power wires.

LEDs on adhesive transfer tape

A limited flicker decorative light-emitting diode (LED) string includes a power plug adapted to connect to an alternating current (AC) power source and supply AC power to the LED string, a first pair of LEDs and a second pair of LEDs, a plurality of LEDs electrically connected in series to form an LED series, and a plurality of rectifying diodes. The plurality of rectifying diodes provides full-wave rectification of the AC power to the LED series and half-wave rectification of the AC power to the first and second pair of LEDs.

Growing community of inventors

Cannon Falls, MN, United States of America

Robert Neuman