Dow Corning Corporation

Robert Nelson

Loren D Lower

Maneesh Bahadur

William Blackwood

Anh Be

Stanton James Dent

Todd Matthew Starke

Lyndon James Larson

Debra Charilla Rash

Loren Dale Lower

A process for assembling an airbag for use in vehicle applications is disclosed. The airbag has a seam made from two or more different materials (). The combination of the materials and the process for assembling the airbag minimize the need for sewn seams.

Airbag and process for its assembly

A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 &#x3bc;m/m&#xb0; C. between &#x2212;40 and 150&#xb0; C. and a modulus of from 1 to 300 MPa at 25&#xb0; C., and the silicone member is prepared by the method of the invention.

Semiconductor package and method of preparing same

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Bay City, MI, United States of America

Robert Nelson