International Business Machines Corporation

Robert N Wiggin

Benjamin V Fasano

Yuet-Ying Yu

Charles J Hendricks

Thomas Clarke Morrison

Vincent P Peterson

Hai Pham Longworth

Brian J Wojszynski

Anthony L Plachy

Roger M Eddy

A method and structure for an electronic circuit test and repair apparatus includes both of at least one wiring analyzer to locate circuit shorts and a current source to provide current sufficient to attempt to remove any identified shorts.

Interconnect package cluster probe short removal apparatus and method

A bed-of-nails type or needle-card type test probe has clusters of parallel buckling beams arranged in a spaced arrangement. The buckling beams are arranged and electrically connected within a cluster so that a contaminant, which may be on the device being tested, does not reduce the accuracy of the test measurements. In particular, the spacing of the buckling beams is such that multiple buckling beams are capable of contacting a single feature on an electronics package to be tested. The buckling beams deflect independently of each other in response to compressive force, and the buckling beams within a cluster are electrically connected in parallel to each other to define redundant, independent conductive paths through the buckling beams. In this way, if a contaminant prevents one of the buckling beams of the cluster from making electrical contact with the feature to be tested, the other one or more of the buckling beams of the cluster will make the required electrical connection.

Contamination-tolerant electrical test probe

Multilayer substrates, are fabricated with the incorporation therein of non-destructive test structures utilized to provide visual and electrical test data to facilitate the ascertainment and assessment of potential electrical interface failures. Furthermore, there are provided embedded structures in multilayer substrates, such as are employed in chip carrier packaging, so as to facilitate electrical testing for via to via alignment and interface layer alignment, and to enable the testing of conductive interface electrical integrity of multilayer electrical devices.

Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices

Growing community of inventors

Poughkeepsie, NY, United States of America

Robert N Wiggin