Hewlett-packard Development Company, L.P.

Hewlett-packard Company

Hewlett-packard Development, L.p.

Michael D. Miller

Joseph M. Torgerson

Angela W. Bakkom

Simon Dodd

Robert N. K. Browning

Mark H. Mackenzie

Robert N K Browning

Joseph M Torgerson

Mark H MacKenzie

Michael D Miller

Michael W Cumbie

Matt G Driggers

Angela White Bakkom

Mark Daniel Tucker

Patrick G Mahoney

Ralph L Stathem

Patrick V Boyd

Storrs Townsend Hoen

Leslie Ann Field

Phillip W Barth

Todd A Cleland

Robert C Maze

Michael B Hager

Kenneth D Saul

Rama Prasad

Dale R Oughton

Douglas M Collins

James Michael Gardner

Chien-Hua Chen

Andrew L Van Brocklin

Eric T Martin

Adam L Ghozeil

Manish Giri

Mark Hunter

Siddhartha Bhowmik

Alok Sharan

Swaroop K Kommera

Charles Gustav Schmidt

Ralph L Stathern

Mark H Mackenzie

Angela W Bakkom

A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

Temperature detection and control

In some examples, a liquid container comprises a chamber forming a volume containing a liquid, an elongated strip extending into the volume containing the liquid, a plurality of heaters supported by the strip along the strip, and a plurality of temperature sensors supported by the strip along the strip. The temperature sensors output signals indicative of dissipation of heat from the heaters to indicate a level of the liquid in the volume.

Fluid sensing

In one example a liquid level sensor is described. The sensor includes a carrier and a liquid level sensing interface disposed on the carrier. The liquid level sensing interface includes a number of liquid level sensing devices disposed on an elongated strip. The number of liquid level sensing devices detect a liquid level in a liquid container. The liquid level sensing interface also includes a number of thermal isolation components formed on the elongated strip to thermally isolate adjacent liquid level sensing devices.

Liquid level sensing

In some examples, a liquid container comprises a chamber forming a volume containing a liquid, an elongated strip extending into the volume containing the liquid, the strip supported along a side of the volume such that a face of the strip adjacent the side of the volume is not opposed by the liquid, a plurality of heaters supported by the strip along the strip, and a plurality of temperature sensors supported by the strip along the strip.

Liquid level indicating

Examples provide a series of heaters supported at different depths within the volume. A series of temperature sensors is supported at different depths within the volume. The temperature sensors output signals indicative of dissipation of heat from the heaters to indicate a level of the liquid within the volume.

A fluid ejection device is described. In an example, the fluid ejection device includes a substrate having a chamber formed thereon to contain a fluid. A thin-film stack is formed on the substrate having a resistor formed under the chamber. A transistor is formed in the substrate and coupled to the resistor. A circuit is formed in the substrate coupled to a gate of the transistor to selectively cause the transistor either to supply a firing current to the resistor for ejecting the fluid from the chamber or to dissipate power to warm the device.

Fluid ejection device

A fluid ejection assembly includes a fluid slot formed in a die. The assembly also includes a nozzle column is formed along a side of the fluid slot. The assembly also includes a pair of thermal sensors to measure die temperature at the middle of the nozzle column and at a first end of the nozzle column.

Thermal sensing fluid ejection assembly and method

A print head die () includes slot ribs () having edges () with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side () of a wafer () a series of spaced openings () completely through the wafer () and separated by ribs () followed by wet etching the wafer () from a second opposite side () to recess the ribs () from the second side ().

Print head slot ribs

An inkjet printhead includes a die having a heating element formed thereon. The inkjet printhead also includes a graded die carrier. The graded die carrier is coupled to the die. The graded die carrier has lands that are separated by an ink slot. Each of the lands is graded such that its proximity to the die varies.

Inkjet printhead with graded die carrier

An ink jet print cartridge having a compact electrical interconnect structure that includes a plurality of pairs of columnar arrays of electrical contact areas disposed on a rear wall of the print cartridge and electrically connected to ink drop generators arranged in primitive groups.

Arrangements of interconnect circuit and fluid drop generators

Several improvements have been made in inkjet print cartridges to realize 5 ng drop weights at ejection frequencies of 18 KHz. These improvements include small nozzle openings, improved heater resistor efficiency, and better ink supply reliability.

High print quality inkjet printhead

A narrow ink jet printhead having efficient FET drive circuits that are configured to compensate for parasitic resistances of power traces. The ink jet printhead further includes ground busses that overlap active regions of the FET drive circuits.

Energy balanced printhead design

An ink jet printhead includes a printhead substrate having a plurality of thin film layers and three side by side columnar arrays of drop generators formed in the printhead substrate and extending along a longitudinal extent. Each columnar array has ink drop generators that are separated by an ink drop generator pitch P. The ink drop generators produce ink drops having an ink drop volume that enables multi-pass printing of a resolution that is not less than 1/(2P) dpi along a print axis parallel to the longitudinal extent. Three columnar arrays of FET drive circuits formed in the printhead substrate are employed to energize corresponding columnar arrays of ink drop generators.

Ink jet printhead

An ink jet print cartridge having a compact electrical interconnect structure that includes a plurality of pairs of columnar arrays of electrical contact areas disposed on a front wall of the print cartridge.

Interconnect circuit

A fluid ejection device includes a substrate, drop generators formed on the substrate at a high density, primitive select lines, and a ground line. The drop generators are arranged in primitives of drop generators. Each drop generator includes a heater resistor having a high resistance. Each primitive select line is separately electrically coupled to a corresponding one of the primitives and is configured to connect to a power source. The ground line is electrically coupled to all of the primitives.

Growing community of inventors

Corvallis, OR, United States of America

Robert N K Browning