Applied Materials, Inc.

Robert Moore

Philip Allan Kraus

James D Carducci

Richard Charles Fovell

Silverst Rodrigues

Karthikeyan Balaraman

Sathya Swaroop Ganta

Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.

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Bigfork, MT, United States of America

Robert Moore