Oracle International Corporation

Sun Microsystems, Inc.

Oracle America, Inc.

Robert Moffett

Istvan Novak

Daniel D Gonsalves

Louis Yonlo Tsien

Scott Cooke

Wigneswaran W Balasingham

Embodiments include systems and methods for detecting and/or responding to deficiencies in power interconnect integrity. For example, a first module distributes power to a second module via a high-current mechanical power interconnect. Insufficient integrity in the interconnect can manifest as an impedance, causing potential thermal hazards. A separate (e.g., low-current) interconnect is used to monitor the power being received by the second module from the first module. Embodiments detect when a difference between the power supplied to and received by the second module exceeds a threshold difference, which can indicate deficient interconnect integrity (i.e., a fault). The supply of high-current power to the second module can be substantially immediately interrupted upon detecting the fault.

Power interconnect integrity detection

A memory error injector is defined to include a connector for enabling connection with a standard memory module receptacle. The memory error injector also includes a standard memory block defined to interface with the connector and operate in accordance with a standard memory specification. The memory error injector further includes error injection logic defined to force data transmitted to or from a specified memory location within the standard memory block to a fixed state, for a first number of access cycles addressed to the specified memory location. The error injection logic is defined to force the data to the fixed state during transmission of the data between the connector and the standard memory block.

Memory error injector and associated methods

A bolster plate apparatus, used to secure a semiconductor device intermediate a printed circuit board and a heat sink apparatus, includes either an indentation or an open aperture into which a radio frequency absorptive material may be disposed. The absorptive material may be a ferrite material specifically selected to absorb frequencies in the range of the second to fourth harmonic of the processor clock signal frequency. The type of the ferrite material implanted in the bolster plate is selected to maximize the absorption of radio frequency energy, particularly that emitted at the pad vias on the underside of the printed circuit board, without affecting the signal integrity of the other pad connections. The shape of the cutout or aperture is also defined by the arrangement of RF emitting pads on the underside of the printed circuit board. The open aperture, without any absorptive material, effectively increases the distance between the source of the radio frequency energy and the metal body of the bolster plate, thereby reducing the amount of radio frequency energy absorbed by the bolster plate and the electromagnetic interference generated thereby. Also disclosed is a method for reducing the radiated emission from an adjacent semiconductor device by selectively removing pads from the undersurface of the PCB board to effectively reduce the sources of the radio frequency energy, and, therefore the amount of RF energy capacitively coupled with RF energy metal body of the bolster plate.

Method and apparatus for reducing capacitively coupled radio frequency energy between a semiconductor device and an adjacent metal structure

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Milton, MA, United States of America

Robert Moffett