Teledyne Scientific and Imaging, LLC

Rockwell Scientific Licensing LLC

Coldquanta, Inc.

Robert Mihailovich

Jeffrey DeNatale

Philip Stupar

Vivek Mehrotra

Robert L Borwick, Iii

Rahul Ganguli

Jonathan Bruce Hacker

Alexandros Papavasiliou

Alex Papavasiliou

Graham J Martin

John Mansell

Payam Minoofar

Maximillian Adriano Perez

Adam Young

Jennifer Kuo

Jeff DeNatale

William R Norvell

A micro fabricated electromagnetic device and method for fabricating its component structures, the device having a layered magnetic core of a potentially unlimited number of alternating insulating and magnetic layers depending upon application, physical property and performance characteristic requirements for the device. Methods for fabricating the high performing device permit cost effective, high production rates of the device and its component structures without any degradation in device performance resulting from component layering.

Electromagnetic device having layered magnetic material components and methods for making same

A method of forming void-free, high aspect ratio through-substrate vias by 'bottom-up' electroplating. In one embodiment, the method requires providing a substrate, forming a dielectric layer on the substrate's bottom side, providing at least one perforation through the dielectric layer, forming a via hole through the substrate from its top side to the dielectric layer and over the perforations, forming an isolation layer on the sidewalls of the via hole, forming a metal seed layer on the bottom side of the dielectric layer, electroplating the seed layer such that all of the perforations are plugged, and electroplating up the via hole from the plugs to fill the via hole.

Through-substrate vias formed by bottom-up electroplating

A micro-machined optical shutter includes an entry layer with a through-passage having an input side adapted to receive incoming light and an output side, and an exit layer with a through-passage having an input side comprising a pinhole and an output side. The entry and exit layers are vertically aligned, thereby providing an optical path such that light exiting the entry layer enters the exit layer via the pinhole unless the optical path is interrupted. An actuation plane positioned between the entry and exit layers comprises a shutter blade and an actuator arranged to move the shutter blade laterally with respect to the pinhole when actuated. The shutter blade preferably has a reflective angled surface such that, when the blade covers the pinhole, the angled surface redirects light on the optical path away from the pinhole, preferably into a micromachined beam dump.

Compact, high-performance MEMS-based optical shutter

A micro-fabricated electromagnetic device is provided for on-circuit integration. The electromagnetic device includes a core. The core has a plurality of electrically insulating layers positioned alternatingly between a plurality of magnetic layers to collectively form a continuous laminate having alternating magnetic and electrically insulating layers. The electromagnetic device includes a coil embedded in openings of the semiconductor substrate. An insulating material is positioned in the cavity and between the coil and an inner surface of the core. A method of manufacturing the electromagnetic device includes providing a semiconductor substrate having openings formed therein. Windings of a coil are electroplated and embedded in the openings. The insulating material is coated on or around an exposed surface of the coil. Alternating magnetic layers and electrically insulating layers may be micro-fabricated and electroplated as a single and substantially continuous segment on or around the insulating material.

Micro-fabricated integrated coil and magnetic circuit and method of manufacturing thereof

A method of fabricating silicon waveguides with embedded active circuitry from silicon-on-insulator wafers utilizes photolithographic microfabrication techniques to define waveguide structures and embedded circuit recesses for receiving integrated circuitry. The method utilizes a double masking layer, one layer of which at least partially defines at least one waveguide and the other layer of which at least partially defines the at least one waveguide and at least one embedded circuit recess. The photolithographic microfabrication techniques are sufficiently precise for the required small structural features of high frequency waveguides and the double masking layer allows the method to be completed more efficiently. The basic fabrication method may be extended to provide batch arrays to mass produce silicon waveguide devices.

Method of fabricating silicon waveguides with embedded active circuitry

A microelectromechanical shutter system includes an actuator beam formed in a substrate, at least one actuator electrode spaced apart and electrically isolated from the actuator beam, the at least one actuator electrode angling away from a base of the actuator beam to actuate the actuator beam using a zipper action, and a fiber-optic channel in the substrate to receive a fiber-optic cable. A shutter mirror is included on a distal end of the actuator beam, with the shutter mirror in substantial alignment with a centerline of the fiber-optic channel. Upon application of a voltage between the actuator beam and the at least one actuator electrode, an electrostatic force is created between them to move the shutter mirror across the end of the fiber-optic channel.

Microelectromechanical optical shutter system

A 1:N MEM switch module comprises N MEM switches fabricated on a common substrate, each of which has input and output contacts and a movable contact which bridges the input and output contacts when the switch is actuated. The input contacts are connected to a common input node, and the output contacts are connected to respective output lines. Each output line has an associated inductance and effective capacitance, and is arranged such that its inductance is matched to its effective capacitance. The switches are preferably arranged symmetrically about the terminus point of the signal input line. A phase shifter employs at least two switch modules connected together with N transmission lines having different lengths, operated such that an input signal is routed via one of the transmission lines to effect a desired phase-shift.

1:N MEM switch module

A hybrid circuit phase shifter assembly of RF MEMS switch modules and passive phase delay shifter circuits uses a low loss, preferably flip-chip, interconnection technology. The hybrid circuit assembly approach separates the fabrication of the MEMS switch modules from the fabrication of the passive phase delay circuits thereby avoiding process incompatibilities and low yields and providing substantial production cost savings. In another aspect of the invention, the integration on a common substrate of a MEMS-based hybrid circuit phase shifter assembly behind each of a plurality of radiating elements provides a compact, low cost electronic scanning antenna array.

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Newbury Park, CA, United States of America

Robert Mihailovich