Lockheed Martin Corporation

General Electric Company

Rca Inc.

Robert Michael Reese

Brian Alan Pluymers

Norman R Landry

John Fraschilla

Richard Earl Miller

An antenna array coacts with a ground plane for radiation. Calibration of the array is accomplished with the aid of one or more extensible calibration antenna elements, such as monopole antenna elements. Each calibration monopole is ordinarily retracted below the ground plane and is not 'energized.' When calibration is desired, it is extended to protrude above the ground plane so as to achieve mutual coupling with one or more of the elements of the array antenna. Calibration signals may be passed in either direction. The calibration antenna may be extended/retracted by vacuum, mechanical device, or electrical motor.

Extendable/retractable antenna calibration element

A generally planar active array antenna includes a plurality of transmit-receive (TR) modules arrayed in an array direction on a generally planar heat-conducting baseplate of a line-replaceable unit (LRU). Heat is coupled from the TR modules to their associated baseplate. Each baseplate of an LRU has a straight edge parallel to the array direction of the modules. In a preferred embodiment, the modules are located adjacent the straight edge without significant intermediary components. The LRUs are arrayed with their straight edges lying in a plane. The straight edges are coupled to a generally planar cold plate for extracting heat from the baseplates. Since the heat is extracted in a direction orthogonal to the arraying direction of the modules, all the modules tend to have the same operating temperature. In a particularly advantageous embodiment, the circulators associated with each TR module are mounted on the opposite side of the cold plate relative to the module, to thereby minimize the thermal path length between each module and the cold plate.

Low-temperature-difference TR module mounting, and antenna array using such mounting

A cooling arrangement useful for semiconductors or solid-state assemblages mounts the semiconductor or other solid-state device directly onto a first surface of a thermally conductive &ldquo;heat spreader.&rdquo; The heat spreader contains microchannels which open into coolant fluid ports on the second side of the heat spreader. The heat spreader, in turn, is mounted on a coolant fluid distribution or circulation plate. In one embodiment, the coolant fluid distribution plate also includes a micropump for circulating coolant fluid through the microchannels of the heat spreader. In another embodiment, the coolant fluid distribution plate simply distributes coolant applied to its fluid input port to those heat spreaders mounted thereon, and a plurality of coolant fluid distribution plates are mounted on a coolant fluid circulation plate, which uses a micropump to circulate coolant fluid to the various distribution plates and ultimately to the heat spreaders. Thus, coolant fluid is communicated directly into the support for the semiconductor chip or other solid-state device, for good heat transfer with low temperature drop.( )

Solid-state chip cooling by use of microchannel coolant flow

An array of antenna elements is arranged to calibration by assigning certain ones of the elements to be &ldquo;kernel&rdquo; elements. The kernel elements are coupled to the beamformer by way of a directional coupler arrangement, and calibration ports are coupled to ports of the directional coupler. Calibration includes applying signal to a first calibration port of a kernel element and determining the amplitude andor phase of the calibration signal paths. Signals are applied to the beamformer ports feeding the kernel element, and the lengths of the beamformer-plus-calibration paths are determined. From these, the beamformer paths to the kernel elements are determined. Other non-kernel antenna elements near the kernel elements are calibrated by applying signal through the beamformer to the non-kernel element, and receiving the signal through a calibration path of the kernel element.

Structure for an array antenna, and calibration method therefor

A compact, liquid cooled, ferrite phase shifter is capable of handling high power microwave signals without thermally stressing the ferrite core. The ferrite core is mounted on spacers inside of a hermetically sealed wave guide filled with a thermally conducting fluid. Heat transfer from the core to the housing is symmetrical thereby eliminating or minimizing thermal bending stresses on the phase shifter. Heat from the core is also coupled through the fluid to the phase shifter window for deicing the window.

Liquid cooled, high power, ferrite phase shifter for phased array

A corrosion resistant resilient electrically conductive gasket is comprised of a metal-containing conductive elastomer which has had any exposed metal coated with a protective conductive coating. The metal may be silver and the coating may be tin-lead solder applied by immersing the gasket into a molten solder bath.

Growing community of inventors

Philadelphia, PA, United States of America

Robert Michael Reese