H. a. Schlatter Ag.

Robert Meier

Dietmar Rappold

In a process for separating wires of a wire bundle the latter is delivered onto feed plane (3) which is sloped in feed direction (3) so that it or the wires move under the action of gravity onto guide element (6) with a control gap. The control gap has a gap width corresponding to the wire diameter and is made to hold the separated wires in the form of a single wire layer. Before the wire bundle can reach the control gap, it is handled using several handling elements (8.1, 8.2, 9.1, 9.2, 10.1, 10.2) located next to one another. They have a strike edge parallel to the feed plane and a scraping edge pointed against the wire bundle, and they execute a striking motion which is such that in the first cycle segment the strike edge, proceeding from the starting point, is guided opposite feed direction (5) over the single wire layer just formed and in a second cycle segment the strike edge is raised from the wire layer in order to be returned to the starting point. Handling elements (10.1, 10.2) which lie farther to the outside follow in phase behind those farther to the inside. To separate wires with especially small diameter:length ratios, two rejectors (7.1, 7.2) can also be provided which execute linear motion at a constant distance to feed plane (3) without touching single wire layer (14). In doing so the amplitude of motion of rejectors (7.1, 7.2) is much greater than that of handling elements (8.1, 8.2, 9.1, 9.2, 10.1, 10.2).

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Wettswil, Switzerland

Robert Meier