International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

International Business Macjines Coporation

Robert Maynard Japp

Mark David Poliks

Bernd Karl Appelt

William John Rudik

Kostantinos I Papathomas

Kostas I Papathomas

Voya Rista Markovich

Konstantinos I Papathomas

Donald Seton Farquhar

William Thomas Fotorny

John M Lauffer

Francis Joseph Downes, Jr

Lawrence Robert Blumberg

John Frank Surowka

John Steven Kresge

Elizabeth F Foster

Gregory A Kevern

David L Thomas

Christina Marie Boyko

Michael Joseph Klodowski

Ross Downey Havens

Jan Obrzut

Cheryl L Palomaki

Mark Vincent Pierson

Frank Daniel Egitto

David Brian Stone

Alfred Viehbeck

Jeffrey Curtis Hedrick

Douglas Oliver Powell

Thomas R Miller

Irving Memis

James Robert Wilcox

Stephen L Tisdale

Gerald Walter Jones

Robert David Sebesta

Brian Eugene Curcio

Jeffrey Alan Knight

Jeffrey McKeveny

Manh-Quan Tam Nguyen

Francis S Poch

Kenneth Lynn Potter

Pamela Lulkoski

Kostas I Papthomas

David W Wang

William E Wilson

Lisa Jeanine Jimarez

Ashwinkumar C Bhatt

Raymond Thomas Galasco

Cory J Ruud

William J Summa

Timothy Eugene Antesberger

Michael James Cummings

Bernd Karl-Heinz Appelt

Amarjit S Rai

Leroy N Chellis

Bonnie S McClure

Anne Marie Quinn

Robert J Harendza

Anne M Quinn, Deceased

Donald E Hanford

Frank J Downes, Jr

A method of making a circuitized substrate including a composite layer having a first dielectric sub-layer including a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein.

Method of making halogen-free circuitized substrate with reduced thermal expansion

A circuitized substrate which includes at least one circuit layer and at least one substantially solid dielectric layer comprised of a dielectric composition which includes a cured resin material and a predetermined percentage by weight of particulate fillers, but not including continuous or semi-continuous fibers as part thereof.

Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers

A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.

Multilayered circuitized substrate with P-aramid dielectric layers and method of making same

A power core adapted for use as part of a circuitized substrate, e.g., a PCB or LCC. The core includes a first layer of low expansion dielectric and two added layers of a different low expansion dielectric bonded thereto, with two conductive layers positioned on the two added low expansion dielectric layers. At least one of the conductive layers serves as a power plane for the power core, which in turn is usable within a circuitized substrate, also provided. Methods of making the power core and circuitized substrate are also provided. The use of different low expansion dielectric materials for the power core enables the use of support enhancing fiberglass in one layer while such use is precluded in the other two dielectric layers, thus preventing CAF shorting problems in highly precisely defined thru holes formed within the power core.

Power core for use in circuitized substrate and method of making same

A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.

Circuitized substrate with continuous thermoplastic support film dielectric layers

A dielectric composition which is adapted for combining with a supporting material ( e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage by weight of a filler, and, significantly, only a minor amount of bromine. A circuitized substrate comprised of one or more of these dielectric layers and one or more conductive layers is also provided.

Dielectric composition for use in circuitized substrates and circuitized substrate including same

A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein. A method of making such a substrate is also provided, as is a multilayered assembly including one or more such circuitized substrates, possibly in combination with other substrates. An information handling system designed for having one or more such circuitized substrates is also provided.

Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same

Multilayered circuitized substrate with p-aramid dielectric layers and method of making same

A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each opening including a cover member located therein. During lamination, the cover members for a seal and prevent dielectric material (e.g., resin) liquefied during the lamination from contacting the conductive layers on the opposed surfaces of the inner (first) substrate. A PCB is thus formed with either a projecting edge portion or a plurality of cavities therein such that electrical connection may be made to the PCB using an edge connector or the like.

Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

An information handling system which includes as part thereof a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.

Information handling system including a circuitized substrate having a dielectric layer without continuous fibers

A circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof. An electrical assembly and a method of making the substrate are also provided, as is an information handling system (e.g., computer) incorporating the circuitized substrate of the invention as part thereof.

Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same

A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like, the composition including at least two fluoropolymers and two inorganic fillers. A circuitized substrate including at least one such dielectric layer and at least one conductive layer thereon is also provided.

Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same

A method of making a circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer.

Method of making circuitized substrate

A method of making a circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof.

Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion

A method of making a circuitized substrate and an electrical assembly utilizing same in which the substrate is comprised of at least two sub-composites in which the dielectric material of at least one of these sub-composites is heated during bonding (e.g., lamination) to the other sufficiently to cause the dielectric material to flow into and substantially fill openings in a conductive layer for the bonded structure. Conductive thru-holes are formed within the bonded structure to couple selected ones of the structure's conductive layers. Formation of an electrical assembly is possible by positioning one or more electrical components (e.g., semiconductor chips or chip carriers) on the final structure and electrically coupling these to the structure's external circuitry.

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Vestal, NY, United States of America

Robert Maynard Japp