Advanced Micro Devices Corporation

Robert Matthew Ulfig

Suzette Keefe Pangrle

Jeremias D Romero

Alline F Myers

Richard E Lamm

A method for measuring porosity of nanoporous materials is provided using atomic force microscopy (AFM). A surface topology map with sub-atomic resolution is created using AFM wherein the pore shape and size can be determined by measuring the pores that intersect the top or fracture surface. For porous materials requiring more accurate measurements, small scan areas with slow scan speed and fine AFM tips are used and a general estimation on distribution can be made from a sample area.

Method for determining pore characteristics in porous materials

An improved chemical mechanical polishing apparatus for polishing a semiconductor wafer used in the fabrication of silicon-based semiconductor devices is provided so as to eliminate an air pocket bubble from being formed underneath a polishing pad without the need for cutting the same. This is achieved by a CMP platen plug which is disposed in a recess formed in a top cover plate member so as to completely fill the recess in order to displace the air pocket. The polishing pad is then secured over the platen plug and the top cover plate member. As a result, the useful life of the polishing pad has been prolonged.

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Middletown, WI, United States of America

Robert Matthew Ulfig