Hewlett Packard Enterprise Development LP

Silicon Graphics International Corporation

Robert Mascia

Steven J Dean

Harvey John Lunsman

Michael Scott

John P Franz

Peter A Hansen

Steven Martin

Brian T Purcell

David Collins

Torsten Wilde

Harvey White, Jr

Timothy Scott McCann

Rob J Rongstad

Mike Kubisiak

Michael Kubisiak

Jared Johnson

A process includes communicating a coolant flow between an inlet and an outlet of a coolant subsystem that is associated with a cooling domain to remove thermal energy from a plurality of processor-based nodes of the cooling domain. The communication of the coolant flow has associated predefined parameters. The process includes regulating a temperature of the coolant flow at the outlet. In accordance with example implementations, the regulation includes determining, based on the predefined parameters, a minimum collective power consumption by the processor-based nodes to maintain a temperature of the coolant flow at the outlet at or above a minimum threshold temperature, and based on the minimum power consumption, scheduling jobs to be executed by the nodes.

Scheduling jobs for processor-based nodes to regulate coolant flow temperatures

A screw-latching assembly is provided. The assembly includes a screw with a head, a tip, and a body between the head and tip. The body includes a threaded portion adjacent to the tip and an unthreaded portion adjacent to the head, and the unthreaded portion includes a built-in collar with an outer diameter larger than that of the body. The assembly includes a supporting bracket supporting and partially encompassing a first portion of the screw. The supporting bracket includes a base and multiple sidewalls, with a first sidewall comprising a first opening to allow a second portion of the screw to extend out of the supporting bracket and a second sidewall comprising a second opening to allow access to the head by a torquing tool. The assembly includes a spring surrounding at least a portion of the body, with the spring positioned between the built-in collar and the first sidewall.

Compact screw-latching assembly with overdrive protection

A technique for managing undervoltage in a compute system is disclosed. The technique includes a method that further includes: detecting an AC undervoltage condition in the compute system; and upon detecting the AC undervoltage condition: dynamically determining a holdup time as a function of the present load; determining a monitoring period as a function of the dynamically determined holdup time; waiting for the determined monitoring period to expire; and upon expiration of the determined monitoring period, perform a shutdown process if the AC undervoltage condition persists.

Dynamic timing for shutdown including asynchronous dynamic random access memory refresh (ADR) due to AC undervoltage

A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

Power supply dry disconnect liquid cooling

An example electrical and liquid coolant midplane includes an electrical midplane having a ring bus bar assembly, a liquid coolant manifold, and a heat transfer device. The ring bus bar assembly is to receive power from power supply units of the computing system and provide the power to computing components installed in the computing system. The liquid coolant manifold includes four segments connected together as a rectangular ring, the liquid coolant manifold including first liquid connectors facing in a first direction and second liquid connectors facing in a second direction opposite the first direction. The heat transfer device is in contact with the ring bus bar assembly and one of the segments of the liquid coolant manifold, to thermally couple the ring bus bar assembly with the manifold to provide liquid cooling to the ring bus bar assembly.

Electrical and liquid cooling midplane

A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus.

Independent removable computer rack power distribution system for high-density clustered computer system

Growing community of inventors

Chippewa Falls, WI, United States of America

Robert Mascia