Auto Splice Systems Inc.

Autosplice, Inc.

Interplex Industries, Inc.

Robert Martin Bogursky

Giuseppe Bianca

Leonid Foshansky

Craig Kennedy

Mark Saunders

Peter V Bellantoni

Darrel Wood

Joseph J Lynch

Kenneth Krone

George Marc Simmel

Bengt E Nyman

Jerome L Weber

Scott C Proctor

Douglas P Green

Kenneth P Krone

Irwin Zahn

Richard Howe

Chaitanya Arekar

Kyle James Ovard, Jr

Timothy Stephany

Martin E McGrath

Michael Krupin

John Hover

Frederick W Grabau

Darryl Wood

Darrel Wood Ii

An electrically conductive contact and a method of forming the same from a length of wire are disclosed. The contact has a pin section connected to a fastening section. The fastening section is adapted for press-fitting into the hole of a substrate and includes a solid tip, a neck connected to the pin section, first and second arcuate side surfaces, and first and second major surfaces through which an enlarged slot extends. Each of the first and second major surfaces is at least partially flattened.

Press-fit contact pin

Improved actuator apparatus and methodologies for manufacturing and using the same. In one exemplary embodiment, the actuator apparatus includes an SMA filament that: (1) minimizes size and increases stroke length via a serpentine-like routing of the SMA filament within the device itself; (2) reduces power consumption as a result of a relatively flat stroke force as a function of stroke displacement operating profile; (3) enables the actuator assembly to remain in a fully actuated state, at a consistent stroke force, for longer periods of time; and (4) is also fully reversible so as to be capable of use in both push-based and pull-based actuator applications. Methods of operation and manufacturing associated with the aforementioned actuator apparatus are also disclosed.

Memory alloy-actuated apparatus

Memory alloy-actuated apparatus and methods for making and using the same

Power-efficient actuator apparatus and methods. In one exemplary embodiment, the actuator assembly utilizes a shape memory alloy (SMA) filament driven by an electronic power source to induce movement in the underlying assembly to actuate a load (e.g., water valve). In addition, a circuit board is included which allows the actuator assembly to be readily incorporated or retrofit into a wide range of systems such that the signal characteristics of the supply line can, among other applications, be conditioned in order to protect the SMA filament. Furthermore, the circuit board can also readily be adapted for use with 'green' power sources such as photovoltaic systems and the like. Methods for manufacturing and utilizing the aforementioned actuator assembly are also disclosed.

Power-efficient actuator assemblies and methods of manufacture

Apparatus and methods for filament crimping. In one embodiment, the apparatus comprises a body and a filament crimp element. The filament crimp element comprises a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Methods and apparatus for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Apparatus and methods for filament crimping and manufacturing

Actuator apparatus having a multi-stable element actuated by memory alloy actuating elements. In one embodiment, the multi-stable actuator comprises a bistable (two-state) diaphragm element adapted to alternate between two stable configurations via forces exerted on the diaphragm by more than one memory alloy filaments in response to thermal activation. In another embodiment, the bistable diaphragm of the multi-stable actuator transitions from a first to a second stable configuration via forces exerted by a single filament in response to direct or indirect thermal activation. A portion of the assembly is displaced when the assembly is in the second configuration. The bistable diaphragm transitions back to the first stable configuration via application of mechanical force on a portion of the assembly which was displaced. Methods for making and using the bistable actuator apparatus are also disclosed.

Multi-stable actuation apparatus and methods for making and using the same

A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.

Electronic shielding apparatus and methods

Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

Discrete solder ball contact and circuit board assembly utilizing same

A plurality of discrete SMT pins are carried in bandoleer fashion. Each SMT pin has a base formed on its underside with solder flux vapor venting channels and a shaft with a longitudinal axis connected to the base. A consecutive series of identical pin holding segments are arranged in side-by-side or end-to-end fashion to provide a flexible strip windable about a reel. The strip is continuously injection molded of plastic as a plurality of strings each made up of a predetermined number of part holding segments with a forward portion of each string, except for leading string of the strip, being molded over a trailing portion of a preceding string. Each pin holding segment has a receptacle formed by a pair of opposing resilient fingers for frictionally removably holding a shaft of a corresponding SMT pin so that the pin can be inserted and removed in a direction substantially normal to the longitudinal axis of its shaft. Each pin holding segment is configured as a substantially rectangular body spaced from and parallel to an adjacent pin holding segment. At least one shoulder of each body provides a drive surface for engagement by a drive member or sprocket of a feeder for advancing the strip in an automatic pick and place machine.

Continuous carrier to SMT pins

A new continuous carrier for surface mount or other electrical or mechanical parts, and a method of fabricating same, formed by molding one or a pair of continuous flexible film strips to a side or sides of a series of desired electrical or mechanical components such that the components are attached to the single strip or filament or suspended between the film strips or filaments. Following the initial molding step, the components, while still supported by the film strips or filament, are subjected to secondary processing Examples are: providing electrically-conductive coatings on the component throughout or selectively, providing electrically-conductive traces on the moldings, or molding in a second molding stage a part of a different composition or shape to the initial molded part. The film stips may be provided with sprocket holes or other equivalent structure for advancing the film strips during the molding process and for reeling up the result assembly onto a reel for sale or distribution to a PCB assembler.

Secondary processing for electrical or mechanical components molded to continuous carrier supports

A novel press-fit electrically-conductive contact member, as, for example, an electrically-conductive metal pin, characterized by a conforming section which has an elastically-deformable region which acts as a spring and which is adapted to engage a substrate hole in a press-fitting relationship. The conforming section comprises opposed beam members configured to accommodate a considerably larger hole tolerance yet still provide sufficient retention force to stabilize the pin during a soldering process that such substrates may typically undergo. The beam cross-sections are configured to allow them to occupy a side-by-side position. Contact members with the conforming section can be manufactured by a wire-forming process in which end-to-end connected pins are formed as a continuous strip needing no excess material for carrying the pins, nor are any air gaps formed between the pins, and thus the finished continuous strip of pins can be wound up on a reel.

Conforming press-fit contact pin for printed circuit board

Growing community of inventors

Encinitas, CA, United States of America

Robert Martin Bogursky