Novellus Systems Incorporated

Lam Research Corporation

Robert Marshall Stowell

Shantinath Ghongadi

Jingbin Feng

Frederick Dean Wilmot

Ashwin Ramesh

Steven T Mayer

Jonathan David Reid

David W Porter

Haiying Fu

Matthew S Thorum

John Derwood Herb

Edmund Minshall

Mark J Willey

Tighe A Spurlin

John F Stumpf

Lee J Brogan

Brian Severson

Quan Ma

Aaron Louis LaBrie

Timothy Patrick Cleary

James E Duncan

Rand Conner

Ludan Huang

Claudiu Valentin Puha

David T Marquardt

Charles Lorenzo Merrill

Kevin Bertsch

Gerramine S Manuguid

James Jed Crawford

Franklin D Root

Hyosang S Lee

Jasent Montano

Yu Ding

In one embodiment, the disclosed apparatus is an in-situ, closed-loop bubble and foam detection and reduction system that includes a liquid-level sensor to determine a volume of a liquid in a fluid reservoir, a mass-detection device to determine a mass of the fluid reservoir and any liquid contained within the fluid reservoir, a processor electrically coupled to the liquid-level sensor and the mass-detection device to determine an actual volume of the liquid within the fluid reservoir, and a showerhead coupled to the processor and positioned above the fluid reservoir. The showerhead is activated by the processor when a volume of the liquid determined by the liquid-level sensor exceeds the actual volume of the liquid by a predetermined amount. Other apparatuses and methods are disclosed.

In-situ sensor-fusion with artificial intelligence

Disclosed are cup assemblies for holding, sealing, and providing electrical power to a semiconductor substrate during electroplating which may include a cup bottom element having a main body portion and a moment arm, an elastomeric sealing element disposed on the moment arm, and an electrical contact element disposed on the elastomeric sealing element. The main body portion may be such that it does not substantially flex when a substrate is pressed against the moment arm, and it may be rigidly affixed to another feature of the cup structure. The ratio of the average vertical thickness of the main body portion to that of the moment arm may be greater than about 5. The electrical contact element may have a substantially flat but flexible contact portion disposed upon a substantially horizontal portion of the sealing element. The elastomeric sealing element may be integrated with the cup bottom element during manufacturing.

Lipseals and contact elements for semiconductor electroplating apparatuses

The present disclosure generally relates to chuck technology for supporting semiconductor wafers during processing. In one example, a wafer chuck assembly comprises a chuck hub and a centering hub disposed within the chuck hub. An engagement device is operable between an engaged position and a disengaged position respectively to engage the chuck hub with the centering hub to prevent relative movement therebetween in at least a first direction, or to allow relative movement therebetween. A chuck motor is provided for selectively rotating the chuck hub and/or the centering hub during a wafer processing operation and a wafer centering operation based on an engaged or disengaged position of the engagement device. A plurality of chuck arms is mounted to the chuck hub, each chuck arm extending radially between a proximal end adjacent the chuck hub, and a distal end remote therefrom. Each of a plurality of centering cams is mounted at or towards a distal end of a chuck arm, and movable to engage or release a wafer edge in response to rotational movement of the centering hub relative to the chuck hub.

Wafer chuck assembly

Disclosed herein are lipseal assemblies for use in electroplating clamshells which may include an elastomeric lipseal for excluding plating solution from a peripheral region of a semiconductor substrate and one or more electrical contact elements. The contact elements may be structurally integrated with the elastomeric lipseal. The lipseal assemblies may include one or more flexible contact elements at least a portion of which may be conformally positioned on an upper surface of the elastomeric lipseal, and may be configured to flex and form a conformal contact surface that interfaces with the substrate. Some elastomeric lipseals disclosed herein may support, align, and seal a substrate in a clamshell, and may include a flexible elastomeric upper portion located above a flexible elastomeric support edge, the upper portion having a top surface and an inner side surface, the later configured to move inward and align the substrate upon compression of the top surface.

Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.

Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte

Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

CMP apparatus and method

Growing community of inventors

Wilsonville, OR, United States of America

Robert Marshall Stowell