Adhesives Research, Inc.

Robert M Wigdorski

Kevin McKinney

Michael John Zajaczkowski

Donald Herr

Michael J Zajackowski

An actinic radiation activated, thermally curable solid film adhesive is disclosed that includes a film forming polymeric binder, a cationically curable resin, and a cationic photoinitiator. The solid film adhesive is capable of being processed at temperatures up to 120&#xb0; C. prior to exposure to actinic radiation without curing, has a latency period at room temperature following activation of the initiator, and is curable at temperatures above 50&#xb0; C. following activation of the initiator.

Reactive film adhesive

A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer whose homopolymer has a Tg>20&deg; C., optionally a C (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the monomers being present in an amount such that the copolymer has a Tg>50&deg; C. When blended with at least one liquid epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be cured.

High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive

A method for the production of glass or plastic laminates is provided comprising applying between opposing faces of glass or plastic substrates a pressure sensitive adhesive comprised of a curable blend of an epoxy resin and a polymer comprised of the polymerization reaction product of an alkyl (meth)acrylate monomer whose homopolymer has a Tg>20&deg; C., optionally a C (meth)acrylate monomer, a nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the monomers being present in an amount such that the copolymer has a Tg>50&deg; C., and curing the adhesive.

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Red Lion, PA, United States of America

Robert M Wigdorski