Agere Systems Guardian Corp.

Robert M Symons

Frank Miceli

Alvaro Maury

Jose Omar Rodriguez

John A Maze, Iii

The present invention provides a wafer carrier for use with a semiconductor wafer polishing apparatus. In one embodiment, the wafer carrier comprises a carrying head having opposing first and second surfaces, a primary channel system formed in the second surface, and a secondary channel system formed in the second surface. The first surface is coupleable to the semiconductor polishing apparatus and the second surface is adapted to receive a semiconductor wafer to be polished. The primary channel system comprises first and second intersecting channels. The secondary channel system intersects the primary channel system so that the secondary channel system and the primary channel system cooperate to occupy a substantial portion of a surface area of the second surface. Therefore, the primary channel system and the secondary channel system decrease an amount of force required to remove the semiconductor wafer from the second surface.

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Orlando, FL, United States of America

Robert M Symons