Growing community of inventors

Dayton, OH, United States of America

Robert M Perchak

Average Co-Inventor Count = 1.15

ph-index = 7

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 131

Robert M PerchakJonathan A Jackson (2 patents)Robert M PerchakEdward E Hart (1 patent)Robert M PerchakRobin Gwen McCarty (1 patent)Robert M PerchakJohn P Dugan (1 patent)Robert M PerchakRichard D'Alessandro (1 patent)Robert M PerchakRobert M Perchak (15 patents)Jonathan A JacksonJonathan A Jackson (16 patents)Edward E HartEdward E Hart (10 patents)Robin Gwen McCartyRobin Gwen McCarty (4 patents)John P DuganJohn P Dugan (4 patents)Richard D'AlessandroRichard D'Alessandro (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Mirage Development, Ltd. (8 from 8 patents)

2. Other (2 from 832,843 patents)

3. Spectra Precision, Inc. (2 from 21 patents)

4. Ncr Corporation (1 from 4,491 patents)

5. Trimble Navigation Limited (1 from 1,186 patents)

6. Mirage Holography Ltd. (1 from 1 patent)


15 patents:

1. 7920337 - Wide angle surface generator and target

2. 7497021 - Multi-axis bubble vial device

3. 6628405 - Optical angle finder and coaxial alignment device

4. 6515783 - Penta assembly skew compensator

5. 6292258 - Laser receiver with out-of-plumb indication and compensation

6. 6081333 - Bi-lateral shearing interferometer with beam convergence/divergence

7. 6054717 - Beam centering system

8. 5994688 - Position leveling sensor for a laser transmitter

9. 5923426 - Bi-lateral shearing interferometer

10. 5896475 - Thin lightguide target for laser alignment

11. 5818633 - Laser leveling target with fresnel lens system

12. 5760932 - Target for laser leveling systems

13. 5710647 - Target for laser leveling systems

14. 5448362 - Non-contact measurement of displacement and changes in dimension of

15. 4402185 - Thermoelectric (peltier effect) hot/cold socket for packaged I.C.

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as of
12/29/2025
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