Stratos Lightwave, Inc.

Robert M Dwarkin

Patrick B Gilliland

Carlos Jines

Raul Medina

Gregg R Rapala

A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.

Small format optical subassembly

A device which is surface mountable to a printed circuit board. The device includes a housing, an optical sub-assembly, and an electrical connector. The housing includes a fiber optic connector receptacle and a bottom side. The housing is made of an electrically conductive material. The optical sub-assembly is associated with the fiber optic connector receptacle. The electrical connector has contacts, where some portions of the contacts extend into the housing and some portions of the contacts extend from the housing. A portion of the contacts being in a same plane with the bottom side of the housing.

Surface mountable optoelectronic device

An optoelectronic interconnect module comprising a housing having a first aperture on a first side of the housing for receiving an optical ferrule and a second aperture on a second side of the housing for receiving a semiconductor die. A mirror is mounted within the housing at an angle for reflecting optical transmissions between the first and second apertures. A first optical lens is mounted between the first aperture and the mirror, and a second optical lens is mounted between the second aperture and the mirror. The optoelectronic interconnect module transmits an electronically modulated optical signal between an optical fiber in the first aperture and an optoelectronic semiconductor die adjacent to the second aperture within a mutually orthogonal plane.

Optoelectronic interconnect module

The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electro-magnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.

Growing community of inventors

Chicago, IL, United States of America

Robert M Dwarkin