Litton Systems, Inc.

The Phoenix Company of Chicago, Inc.

Northrop Grumman Systems Corporation

Robert M Bradley

John E Maturo

Michael P Driscoll

Stephen Vetter

Michael N Perugini

Carmine Gugliotti

Lee A Wolfel

Robert O Beadle

William R Keller

Sondra Morrissey

James R Balistreri

Robert M Bogursky

John E Jones

Charles A Toye, Jr

A connection system for a quantum computer that employs constant impedance connectors with attenuation or filtering components or both embedded therein or within an adaptor removably insertable within an adaptor housing for use in a cryogenically cooled quantum computer. The connection system provides a higher density of cables traversing through a hermetic sealed top plate, and which are accessible to chill blocks to reduce the thermal energy from the signal lines. Attenuators or filter circuits are embedded in the constant impedance connector housings, or provided in adaptors that connect on each end to form mating constant impedance connections, in order to reduce signal strength as the signal progresses through the cryogenic environment and to remove extraneous electrical signal noise.

Connection system for tiered stages

Constant impedance connector system

A signal connection system that employs constant impedance connectors with attenuation or filtering components or both embedded therein or within an adaptor removably insertable within an adaptor housing. The connection system provides a higher density of cables traversing through a hermetic sealed top plate, and which are accessible to chill blocks to reduce the thermal energy from the signal lines. Attenuators or filter circuits are embedded in constant impedance connector header housings, or provided in adaptors that connect on each end to form mating constant impedance connections, in order to reduce signal strength as the signal progresses through the connection system and to remove extraneous electrical signal noise.

Constant impedance connector system for quantum computer applications

A method, system and apparatus for making an interconnection between power cables and signal cables. A single electrical interface in mid- or backplane applications is introduced to accommodate a wide range of board thickness variations while maintaining a desired interface relationship, using a connector plug bushing, a male connector having a sliding fit with the bushing, a first coaxial connector plug, a female connector plug with a housing width sized to provide a sliding fit within the connector plug bushing inner opening, and a second coaxial connector plug in the free end of the female connector plug for connection to the power and signal cables. A constant impedance connector is used with the interconnection of the RF signal and power cables.

Method and apparatus for making an interconnection between power and signal cables

The present invention is directed to a high density electrical connector which can provide 80 or more twinax connections per linear inch in a 20 millimeter card slot. In a typical electronic system package, 20 millimeters is the spacing from center line to center line of the adjacent parallel daughtercards. Twinax cable is coaxial cable that contains two .inner conducting wires rather than one. The two inner conducting wires provide two physical channels. Coaxial cable is called 'coaxial' because it includes one physical channel that carries the signal surrounded (after a layer of insulation) by another concentric physical channel, both running along the same axis. The outer channel serves as ground.

High speed, high density interconnect system for differential and single-ended transmission systems

The invention relates to an electrical connector that can be used to electrically connect a daughtercard to a backplane.

Interconnection system

An interconnection system includes spacers arranged adjacent each other in a row, the spacers having cable sections disposed therein. Each cable section has at least one center conductor and an outer conductive shield. All of the cable sections have one end exposed on a first plane and a second end exposed on a second plane. Electrically conductive contacts are disposed within apertures in a pair of interposers so as to have one end making electrical contact with one of the cable sections and another end extending through its respective aperture in its respective interposer.

The present invention is directed to a high density electrical connector which can provide 80 or more twinax connections per linear inch in a 20 millimeter card slot. In a typical electronic system package, 20 millimeters is the spacing from center line to center line of the adjacent parallel daughtercards. Twinax cable is coaxial cable that contains two inner conducting wires rather than one. The two inner conducting wires provide two physical channels. Coaxial cable is called 'coaxial' because it includes one physical channel that carries the signal surrounded (after a layer of insulation) by another concentric physical channel, both running along the same axis. The outer channel serves as ground.

High speed, high density interconnect system for differential and single-ended transmission applications

A socket connector for a pin connector including a module body with a plurality of slots is described. A plurality of wafers are installable in a corresponding plurality of slots in the module body and each wafer has multiple offset tuning forks. The module body has a coring wall with multiple wedge shaped protrusions for each of the offset tuning forks of the wafer.

Insulator coring and contact configuration to prevent pin stubbing in the throat of tuning fork socket connector contacts

The present invention is used in conjunction with two piece connector systems. The present invention provides an integral keying and an electrostatic discharge path. The daughtercard connector has at least two electrostatic discharge paths into an electrostatic discharge contact which then provides a path to a guide pin of the backpanel housing.

Guide system with integral keying and electrostatic discharge paths for separable pin and socket connector systems

The present invention provides an electrical interconnect system using multiple grounding methods to reduce or prevent spurious signals from interfering with high density contacts carrying high speed transmissions. A first connector includes an insulative pillar partially surrounded by a plurality of signal contacts. A central ground contact is at least partially located within the insulative pillar. A second connector includes a plurality of flexible signal contacts for mating with the signal contacts adjacent the insulative pillar. Additionally, flexible ground contacts in the first connector are in contact with an electrically conductive shield. The second connector also includes a central ground contact for receiving the central ground contact of the first connector. The ground contacts provide a first method of providing a ground path to reduce spurious signals from entering the signal path. The electrically conducting shield is located outside the signal contacts when the first and the second connectors are mated. The electrically conducting shield is a conductive path to ground. The electrically conductive shield has a plurality of openings through which the signal contacts and the insulative pillar extend when the first connector and the second connector are in a mated condition. The first connector includes a member which provides a ground path between the first connector and the electrically conducting shield. Advantageously, the electrical interconnect system can use multiple grounding methods which are particularly important in a high density electrical interconnect system where the contacts are closely spaced and susceptible to noise and other spurious signals.

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Oakville, CT, United States of America

Robert M Bradley