International Business Machines Corporation

Robert Lewis Rohr

Arthur Harry Kendall

Pedro A Chalco

Arthur R Hoffman

Harry D Euler

Carlos C Periu

Robert D MacInnes

A method and apparatus is disclosed for machining very fine, smooth cuts and grooves on minute surfaces such as single point bonding tips. The invention accurately aligns the axis of a reciprocating cutting wire in the direction of reciprocating motion and permits precise positioning and repositioning of the cutting wire on a work surface. The apparatus allows an unobstructed view of the wire in proximity to the workpiece during the alignment, positioning, repositioning, and cutting operations.

High precision micromachining of very fine features

An improved apparatus and method are disclosed for heating objects, such as electronic chips being bonded to substrates, in which a copper heat exchanger element (12) comprises a circuitous interior passage (26) through which gases pass from a source (30) to be heated by a heater (74) to a desired temperature and to be cleansed of unwanted oxygen by catalytic reaction, prior to entering a furnace chamber (22) heated from below by the heat exchanger element (12) and from above by a further heater (72) and copper plate (60), whereby essentially uniform gas temperature, acceptably low oxygen concentration and fast cycling times are provided in the furnace chamber (22). See FIG. 1.

Apparatus for heating objects to and maintaining them at a desired

A pre-aimed nozzle device comprises a nozzle block with an orifice wafer attached thereto. The nozzle block has an aiming surface. The orifice wafer comprises an annular orifice element retained in the body of the wafer in a manner whereby the orifice element and wafer are bonded to the nozzle block with the opening of the orifice element perpendicular to the aiming surface. The orifice wafer is made by encapsulating a straight section of glass tubing in a block of ceramic. The block is machined with precision external location surfaces. A groove is machined into the block with internal location surfaces parallel with the external location surfaces. After potting of the tube in the groove with solder glass, the wafer block is cut along planes perpendicular to the external location surfaces to obtain annular orifice elements precisely aimed relative to the wafer body.

Pre-aimed nozzle for ink jet recorder and method of manufacture

Multiple nozzle arrays are formed from an assembly of at least one pair of plates having intersecting channels for receiving orifice elements and sealant. The joined plates, with inserted orifice elements in one channel and sealant in the other channel are then mounted vertically or at an appropriate angle and exposed to a temperature sufficient to cause the sealant alone to melt and to flow by capillary action to seal the orifice elements in a void-and-bubble free manner and to seal the plates to form a plate block. After cooling, the plate block is sliced into multiple nozzle wafers.

Growing community of inventors

Scarsdale, NY, United States of America

Robert Lewis Rohr