Hewlett-packard Development Company, L.P.

Robert Lee Crane

Tom J Searby

Andrew L Wiltzius

Arlen Lee Roesner

Michael P Eland

Porter Rodgers Arbogast

Erick J Tuttle

Steven E Hanzlik

Jonathan Shea Robinson

Adolfo Adolfo Gomez

Stephen G Uhlmann

River Yao

Mark J Wierbilis

Andrew L Witizius

Julie Duke

Heather Burnam Volesky

In an example implementation, a computer assembly includes a computer enclosure, a motherboard with an inset edge section that forms a motherboard air gap between the motherboard and a rear wall of the enclosure when the motherboard is installed in the enclosure, a vent opening formed in the enclosure below the motherboard, and an air mover to draw air from above the motherboard, through the air gap, and below the motherboard, and to expel the air drawn below the motherboard from the enclosure through the vent opening.

Expelling air from a computer enclosure

An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

Shell ductings for cool air delivery

Examples disclosed herein relate to conversion of an object for a hardware device into health control information. Examples include acquiring, from an object-oriented database, an object for a hardware device including an operational parameter value determined by the hardware device. Examples further include converting the object into health control information useable by a health controller.

Conversion of an object for a hardware device into health control information

A daughterboard can include an airflow path or opening.

Daughterboard having airflow path

Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Removable airflow guide assembly with a processor air cooler and memory bank coolers

Example embodiments disclosed herein relate to identifying a target fan connected to a computing device. In example embodiments, the target fan may be identified based on a fan speed profile of the target fan.

Identifying a fan connected to a computing device

In accordance with at least some embodiments, a computer system include a chassis and a main airflow channel within the chassis. The computer system also includes multiple processors and multiple memory banks positioned in the main airflow channel. The computer system also includes a removable airflow guide assembly installed in the main airflow channel, wherein the removable airflow guide assembly divides the main airflow channel into a processor-side airflow channel and a memory-side airflow channel.

Removable airflow guide assembly for a computer system

A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.

Heat transfer systems and methods

A duct for cooling multiple components in a processor-based device. The duct has an inlet cooling duct section for a cooling airflow focused toward a processor region. The duct also has at least one exit cooling duct section for the cooling airflow extending from the inlet cooling duct section and focused toward a component region, wherein the cooling airflow is successively transportable through the processor region followed by the component region. A processor-based system having a focused cooling duct. The focused cooling duct comprises an inlet cooling duct section for a cooling airflow having a fan receptacle, and a plurality of exit cooling duct sections for the cooling airflow extending from the inlet cooling duct section and focused toward component regions, wherein the cooling airflow is successively transportable through the inlet cooling duct section followed by the plurality of exit cooling duct sections. The processor-based system also comprises a plurality of components disposed in the component regions.

Growing community of inventors

Fort Collins, CO, United States of America

Robert Lee Crane