Quality Vision International Inc.

General Scanning, Inc.

View Engineering, Inc.

Systemation Engineering

Robert Lea Jackson

David A Noblett

Donald J Svetkoff

Donald K Rohrer

Anthony Wen Ge

Robert Cottle Boman

Edward Tarry Polidor

Russell E Dudley

Edward T Polidor

A method of forming a combined feature boundary based on boundaries of first and second overlapping features includes dividing the boundaries of the first and second overlapping features into line segments of known shape, identifying crossing points formed by the line segments, calculating parametric coordinates of the crossing points, and determining a sequence of crossing point evaluation based on the parametric coordinates. The method also includes calculating first and second cross products based on the line segments forming first and second crossing points in the determined sequence, and choosing first and second paths of the combined feature boundary according to mathematical signs of the cross products, wherein the combined feature boundary includes the first and second crossing points and portions of at least one of the first and second feature boundaries defining the first and second paths.

Combining feature boundaries

A method of forming a combined feature boundary based on boundaries of first and second overlapping features includes dividing the boundaries of the first and second overlapping features into line segments of known shape, identifying crossing points formed by the line segments, calculating parametric coordinates of the crossing points, and determining a sequence of crossing point evaluation based on the parametric coordinates. The method also includes calculating a first cross product based on the line segments forming a first crossing point in the determined sequence, and choosing a first path of the combined feature boundary according to a mathematical sign of the first cross product, the first path extending from the first crossing point to the second crossing point in the determined sequence. The method further includes calculating a second cross product based on the line segments forming a second crossing point in the sequence, and choosing a second path of the combined feature boundary extending from the second crossing point according to a mathematical sign of the second cross product, wherein the combined feature boundary includes the first and second crossing points and portions of at least one of the first and second feature boundaries defining the first and second paths.

An autofocus system and method that includes a controllable light source having at least two selectively activated substantially monochromatic output wavelengths adapted for illuminating an object; a camera receiving light from said light source reflected from a portion of said object and generating output signals responsive to said received light; a controller connected to said camera and said controllable light source for positioning said camera and sequentially illuminating a first portion of the object with at least two selectively activated substantially monochromatic output wavelengths, moving the camera to a second position and sequentially illuminating a second portion of the object with at least two selectively activated substantially monochromatic output wavelengths; and a data processor connected to said camera and receiving said output signals and for each portion, comparing the output signals associated with each wavelength and determining a focus parameter from said comparison.

Multi color autofocus apparatus and method

A method and system are provided for flipping a tray of parts such as integrated circuit packages including a pair of flippable storage trays. A first storage tray has an upper surface which forms a grid of storage compartments wherein each of the storage compartments is adapted to hold a single integrated circuit package. Initially, the first tray is received at a flip station from a first part processing station. Then, the first and second trays are joined together so that they mate. Then, the mated first and second trays are inverted so that the packages are held in the second tray. Then, the first and second trays are separated and the second tray which now holds the plurality of packages is transferred to a second part processing station. Then, the cycle is repeated with a third tray of parts and the now empty first tray.

Method and system for flipping a tray of parts

A method and system for three-dimensional imaging of objects, including integrated circuit interconnections and many other microelectronic assemblies and miniature parts, is used to greatly improve the efficiency of triangulation-based laser line scanning systems. A scanning beam is incident at a normal angle to the X,Y inspection plane with the scan line oriented at 45.degree., diagonal to an axis defining a first direction of motion. Motion of the imaging head along the axis is used to acquire line scan images in the non-orthogonal coordinate system having symmetry about the orthogonal axes of motion.

Method and system for triangulation-based, 3-D imaging utilizing an

A high speed, high accuracy, three-dimensional inspection system for ball and pin grid assemblies. The system uses a three-dimensional scanner to gather data which is analyzed to yield height position measurements along with overall packaged dimensions. The grid array to be scanned is placed upon a fixture above a motion control table. The motion control system is controlled by a personal computer and has a high resolution. The parts can be presented in single trays, tray stackers, tubes or other carriers. Array packages are handled either manually or automatically. In the manual mode, arrays are loaded onto the fixture by hand before activated the image processing hardware. Alternatively, an automatic pick and place module may be used to load the grid array packages on the fixture. The fixture consists of a plate with a cavity the size of the grid array package being inspected. The size of the cavity can be adjusted to fit different size parts. In addition to the height and position measurements, measurements of spacing, coplanarity, standoff, grid pitch, ball diameter, ball position, and package warp can be performed. With regard to pin grid arrays, bent or missing pins can be detected with the system. With regard to ball grid arrays, missing balls can be detected.

Grid array inspection system and method

A method and system for three-dimensional imaging of objects, including integrated circuit interconnections to improve the efficiency of triangulation-based laser line scanning systems. A scanning beam is incident at a normal angle to the X,Y inspection plane with the scan line oriented at 45.degree., diagonal to an axis defining a first direction of motion. Motion of the imaging head along the axis is used to acquire line scan images in the non-orthogonal coordinate system.

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Moorpark, CA, United States of America

Robert Lea Jackson