International Business Machines Corporation

Globalfoundries Inc.

Globalfoundries U.S. 2 LLC

Robert L Wisnieff

Evan G Colgan

Paul Stephen Andry

John Ulrich Knickerbocker

Kenneth Parker Rodbell

Christos Dimitrios Dimitrakopoulos

Devendra K Sadana

Chung H Lam

Alfred Grill

Jack Oon Chu

Dirk Pfeiffer

Frank Robert Libsch

Christy Sensenich Tyberg

Wanki Kim

Ning Li

Timothy James McArdle

Ghavam G Shahidi

Guy M Cohen

Cyril Cabral, Jr

Katherine Lynn Saenger

Leland Chang

Qinghuang Lin

Bucknell Chapman Webb

Stephen Mark Rossnagel

Marcus Oliver Freitag

Vijay Narayanan

Theodore Gerard Van Kessel

Kerry Bernstein

Daniel Joseph Friedman

Christopher Vincent Jahnes

Chandrasekharan Kothandaraman

John Michael Cotte

Ramachandran Muralidhar

Eduard Albert Cartier

Lior Horesh

Xiao Hu Liu

Minhua Lu

Richard Harold Boivie

Li-Wen Hung

Seiji Munetoh

Geoffrey W Burr

Qianwen Chen

Raya Horesh

Charanjit Singh Jutla

Kohji Hosokawa

Kai R Schleupen

Peter M Fryer

Chandrasekara Kothandaraman

Leslie C Jenkins

John Christopher Flake

Stephen W Bedell

Michael S Gordon

Paul William Coteus

Lubomyr Taras Romankiw

Conal Eugene Murray

Stephen L Buchwalter

Harold John Hovel

Sung Kwon Kang

Takatoshi Tsujimura

Monty Montague Denneau

Hyun Kyu Seo

Kam Leung Lee

Edwin Peter Dawson Pednault

Nils Deneke Hoivik

Daniel C Edelstein

Sampath Purushothaman

Christian Lavoie

Jeng-Bang Yau

Elbert Emin Huang

Russell Alan Budd

Roy Rongqing Yu

Sri Muthuthamby Sri-Jayantha

Peilin Song

Steven John Koester

Yoichi Taira

Franco Stellari

Steven Alan Cordes

Jeffrey Allen Zitz

Vijayeshwar Das Khanna

Chun-Yung Sung

Philip Joseph Oldiges

James A Culp

Xinlin Wang

Shui-Chih Alan Lien

Rama Nand Singh

Gregory M Fritz

John Harold Magerlein

Shinichi Kimura

Oliver Desmond Patterson

Anthony D Polson

Fumiaki Yamada

Robert J Polastre

Peter Jerome Sorce

Tricia Lynn Breen

Ronald R Troutman

David F Heidel

Yoshikazu Ichioka

Nils D Hoivik

Kenneth F Latzko

Quinghuang Lin

A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.

Encryption engine with an undetectable/tamper-proof private key in late node CMOS technology

Techniques and a system for visualization or interaction with a quantum processor are provided. In one example, a system includes a quantum programming component and a visualization component. The quantum programming component manages a quantum programming process to generate topology data for a quantum processor that is indicative of a physical topology of a set of qubits associated with the quantum processor. The visualization component generates visualization data for the topology data that comprises a set of planar slice elements arranged to correspond to the physical topology of the set of qubits. The set of planar slice elements indicate one or more operations performed at a time step associated with the quantum programming process.

Visualizing or interacting with a quantum processor

Methods and systems for cleaning an optic include cleaning an optic with ultrasonic vibrations. The locations of nodes in a standing wave of the ultrasonic vibrations are changed by changing a frequency of vibration during cleaning.

Ultra-sonic self-cleaning system

A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

Heterogeneous miniaturization platform

Encryption engine with an undetectable/tamper proof private key in late node CMOS technology

Methods and systems for cleaning an optic include measuring a state of the optic. It is determined whether the optic needs to be cleaned based on the measured state of the optic. The optic is cleaned with ultrasonic vibrations if the optic needs to be cleaned.

A structure includes a silicon substrate; silicon readout circuitry disposed on a first portion of a top surface of the substrate and a radiation detecting pixel disposed on a second portion of the top surface of the substrate. The pixel has a plurality of radiation detectors connected with the readout circuitry. The plurality of radiation detectors are composed of at least one visible wavelength radiation detector containing germanium and at least one infrared wavelength radiation detector containing a Group III-V semiconductor material. A method includes providing a silicon substrate; forming silicon readout circuitry on a first portion of a top surface of the substrate and forming a radiation detecting pixel, on a second portion of the top surface of the substrate, that has a plurality of radiation detectors formed to contain a visible wavelength detector composed of germanium and an infrared wavelength detector composed of a Group III-V semiconductor material.

Monolithic visible-infrared focal plane array on silicon

A method comprises forming a structure, the structure comprising at least one of a wafer, a panel and a roll to roll structure and forming a plurality of integrated circuit chips from the structure. At least a given one of the plurality of integrated circuit chips or a heterogeneous integrated sub-component thereof forms a smart tag comprising a processor, a non-volatile memory, an internal power source, and a transceiver configured for two-way communication with a reader external to the smart tag. The given integrated circuit chip less than 10 cubic millimeters in size.

Methods of forming microelectronic smart tags

A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

Three-D power converter in three distinct strata

Growing community of inventors

Ridgefield, CT, United States of America

Robert L Wisnieff