Rca Inc.

General Electric Company

Other

Robert L Schelhorn

Norman R Landry

Samuel L Williams

Colleen A Matier

A Leadless Chip Carrier (LCC) is mounted on a circuit board on elongated solder posts to provide clearance between the LCC and the board. The process for producing solder posts involves the deposition of a temporary stencil surrounding the conductive pads on the board. The removable stencil around the pads provides support for molten solder during reflow and prevents the chip carrier from compressing the molten solder thereby insuring desirable spacing between the chip carrier and the board.

Method for connecting a leadless chip carrier to a substrate

The individual components of a shielded ceramic, RF mounting package are metallized on three of their outer surfaces. The package includes circuit supporting ceramic substrate metallized along its edges as well as on the horizontal surfaces to permit continuous metal contact between the substrate and a metallized ceramic seal ring and the metal lid and base of the package.

Metallized ceramic circuit package

A high power thick film resistor having improved power handling capability is obtained with a resistor having two overlying thick film layers wherein the first thick film layer has a relatively low resistivity and the second thick film layer has a relatively high resistivity.

High power thick film resistor

A method (and the resulting article) comprises the step of providing a surface mounted package connector including a thermal buffer pad. Preferably the surface mounted package is mounted on a circuit board having preselected circuitry thereon. The present method provides a mounting capable of withstanding severe temperature cycling and thermal shocks.

Method of connecting surface mounted packages to a circuit board and the

In accordance with this invention a porcelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In accordance with a further aspect of this invention the boards of this invention are obtained by a method in which the connecting pins are sealed in a spaced relationship in apertures in the metal core of the board and insulated from the core prior to the application of the porcelain to the surfaces of the core.

Porcelain coated metal boards having interconnections between the face

A porcelain coated steel substrate for receiving thick film printed circuit thereon includes thermally and electrically conductive pedestals which are in thermal and electrical contact with the steel core. The pedestal surface is coplanar with the porcelain coating so that a substantially continuous plane surface is present. This permits semiconductor chips readily to be mounted on the substrate, the pedestals serving as heat and electrical conductors to the substrate, and serves also to facilitate the deposition of thick film elements.

Structure for mounting a semiconductor chip to a metal core substrate

An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.

Method of making a composite substrate

In accordance with this invention a procelain coated metal board is provided which has flat surfaces and further has electrical connections between the face and reverse surfaces of the board. In accordance with a further aspect of this invention the boards of this invention are obtained by a method in which the connecting pins are sealed in a spaced relationship in apertures in the metal core of the board and insulated from the core prior to the application of the procelain to the surfaces of the core.

Method for the manufacture of porcelain coated metal boards having

Composite substrate

A thick film resistor element capable of dissipating relatively large amounts of microwave energy comprises several distinct layers of resistive material overlying an electrically insulating thermally conducting substrate. The final dimensions of the element can be made comparatively small with respect to a conventional element having comparable dissipation capability. The element has a coating of a crossover dielectric material which provides a moisture barrier between the element and the ambient.

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Cinnaminson, NJ, United States of America

Robert L Schelhorn