Intevac, Inc.

Robert L Ruck

Kevin P Fairbairn

Terry Bluck

Samuel Dacke Harkness, Iv

Eric C Lawson

Patrick Leahey

Charles Liu

Norman H Pond

Paul Markoff Johnson

Nathan Fo

Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.

System architecture for combined static and pass-by processing

Sequential sputtered film deposition of distinct materials on a workpiece is obtained with discrete targets composed of such distinct materials disposed on separate area portions of a common cathode/heatsink. Sputtering without cross contamination of the deposited films is enabled during an interval of relative motion between the target and workpiece or in an indexed static relative disposition, wherein the workpiece projection is entirely proximate one such portion to deposit the respective layer.

Method and apparatus for multi-target sputtering

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San Jose, CA, United States of America

Robert L Ruck