Axsun Technologies, Inc.

Robert L Payer

Dale C Flanders

Livia M Racz

Mona Masghati

Walid A Atia

Jeffrey A Korn

Randal A Murdza

Minh Van Le

Xiaomei Wang

Eric E Fitch

Walter R Buchwald

L James Newman, Iii

A detector system for a fiber optic component is insensitive to stray light. Specifically, the invention comprises a detector chip, which converts received light into an electric signal. A baffle substrate is positioned over the detector chip. This baffle substrate has a transmission port through which an optical signal is transmitted to the detector chip. As a result, light that is not directed to be transmitted through the port is blocked by the baffle substrate. In this way, it rejects stray light that may be present in the hermetic package. A detector substrate is provided on which the detector chip is mounted. This detector substrate preferably comprises electrical traces to which the detector chip is electrically connected. The detector substrate can further comprise bond pads for wire bonding to make electrical connections to the electrical traces.

Stray light insensitive detector system and amplifier

An optoelectronic hermetic package comprises a frame defining a hermetic boundary and an electrical feedthrough assembly on the frame. This electrical feedthrough assembly provides electrical connections between signal wire bond areas within the hermetic boundary to electrical contact areas outside the hermetic boundary. Additionally, according to the invention, ground wire bond pad areas are also provided within the hermetic boundary, the ground wire bond pad areas being electrically connected to each other and/or the frame or other ground plane.

Hermetic package with internal ground pads

12 of 12 An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.

Bonder chuck and optical component mounting structure interface

An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.

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Pepperell, MA, United States of America

Robert L Payer