Intel Corporation

Robert L Olivier

Steven L Pollock

An apparatus, comprising a substrate having a surface, comprising an array of electrical contacts, and a plurality of electrical planes, where the plurality of electrical planes are positioned within the electrical contact array.

Efficient multiple power and ground distribution of SMT IC packages

An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a ground pin is electrically coupled to the semiconductor die, a ferrite bead is electrically coupled to the EMI shield and the ground pin, and a package body encapsulates the EMI shield.

Integrated circuit package with EMI shield

An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a package body encapsulates the EMI shield.

A connector for mounting a processor card on a motherboard includes a base and an upper support chassis. The base is electrically and structurally coupled to a motherboard and the upper support chassis is mounted on the base. A processor card is received within the upper support chassis for mounting of the card to the motherboard. When the card is received within the upper support chassis, the processor card is positioned substantially parallel to the motherboard.

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Forest Grove, OR, United States of America

Robert L Olivier