Fairchild Semiconductor Corporation

Robert L Krause

Chung-Lin Wu

Janusz Bryzek

Ahmad Ashrafzadeh

Etan Shacham

Maria Clemens Ypil Quinones

John R Constantino

Timwah Luk

In some general aspects, an apparatus may include a first semiconductor die, a second semiconductor die, and a capacitive isolation circuit being coupled to the first semiconductor die and the second semiconductor die. The capacitive isolation circuit may be disposed outside of the first semiconductor die and the second semiconductor die. The first semiconductor die, the second semiconductor die, and the capacitive circuit may be included in a molding of a semiconductor package.

Isolation between semiconductor components

Growing community of inventors

San Jose, CA, United States of America

Robert L Krause