Diamonex, Incorporated

Air Products and Chemicals, Inc.

Robert L Iampietro

Paul N Dyer

Diwakar Garg

Fred M Kimock

Wilman Tsai

Robin Edward Richards

Ernest L Wrecsics

Sui-Yuan Lynn

C Michael Kelly

The present invention is a method for manufacturing inorganic membranes which are capable of separating oxygen from air. The membranes comprise a thin layer of a multicomponent metallic oxide which has been deposited onto a porous substrate by organometallic chemical vapor deposition. The inorganic membranes are formed by reacting organometallic complexes corresponding to each of the respective metals making up the multicomponent metallic oxide and an oxidizing agent under conditions sufficient to deposit a thin layer of the multicomponent metallic oxide onto the porous substrate.

Method for manufacturing inorganic membranes by organometallic chemical

A method for depositing a thick, adherent and coherent polycrystalline diamond (PCD) film onto a metallic substrate using a deposition rate of no greater than 0.4 .mu.m per hour. The resulting PCD Film has a smooth surface finish, enhanced crystal orientation in comparision to industrial grade diamond powder particularly in the (220) and (400) directions, and excellent electrical and thermal properties. The method enables one to deposit PCD films having a thickness of at least 12 microns for applications on flat as well as curved substrates having wide use in the electronics industry. Thick PCD films of this invention have been found to be ideal for dissipating heat from radio frequency (RF) and microwave (MW) devices.

HFCVD method for producing thick, adherent and coherent polycrystalline

An improved hot filament chemical vapor deposition (HFCVD) reactor is disclosed comprising a gas dispersion system, a filament network and an apertured support plate for the substrate. The apertures in the support plate provide for counteracting the natural pressure and temperature gradients which arise within the reactor so that a uniform deposit or material can be coated over the entire surface of multiple small pieces simultaneously. Specifically, the apertured support plate substantially reduces the extent of radial (stagnation point) gas flow adjacent to the substrate which significantly improves coating uniformity.

Hot filament chemical vapor deposition reactor

A thick, adherent and coherent polycrystalline diamond (PCD) coated substrate product is disclosed which comprises either a metallic or ceramic substrate and a plurality of separately deposited PCD layers of substantially uniform microstructure and having high electrical resistivity. The method for depositing multi-layers of PCD film onto the substrate comprises chemically depositing at least two separate polycrystalline diamond layers onto the substrate deposition conditions which are substantially different between cycles. The method enables one to deposit PCD films having a thickness of at least 12 microns for applications on flat as well as curved substrates having wide use in the electronics industry. Thick PCT films of this invention have been found to be ideal for dissipating heat from radio frequency (RF) and microwave (MW) devices.

Hot filament CVD of thick, adherent and coherent polycrystalline diamond

A coated substrate product is disclosed which comprises a substrate and a polycrystalline diamond layer having a smooth surface finish, enhanced crystal orientation in comparison to industrial grade diamond powder particularly in the (220) and (400) directions, and excellent electrical and thermal properties. Also disclosed is a method for fabricating such a coated substrate in which the polycrystalline diamond layer is chemically vapor deposited onto the substrate at substrate temperatures in the range of 650.degree. to 825.degree. C.

Diamond-on-a-substrate for electronic applications

The method for depositing multilayers of PCD film onto the substrate comprises chemically depositing a polycrystalline diamond layers onto the substrate at deposition temperatures in the range of 650.degree. to 825.degree. C., interrupting the deposition process with a cool-down step and then depositing at least one other layer under the same deposition conditions. The method enables one to deposit PCD films having a thickness of at least 12 microns for applications on flat as well as curved substrates having wide use in the electronics industry. Thick PCD films of this invention have been found to be ideal for dissipating heat from radio frequency (RF) and microwave (MW) devices.

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Emmaus, PA, United States of America

Robert L Iampietro