Micron Electronics, Inc.

Micron Technology Incorporated

Other

Micron Custom Manufacturing, Inc. USA

Robert L Canella

Tony T Ibarra

Warren M Farnworth

Dave E Charlton

Scott A Earnest

Greg D Stevenson

A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within a housing assembly. Linear, or rotational, switch actuation element movement may be employed. A holder for the personal light is also disclosed.

Battery-powered lights and holder for same

A personal light including a battery power source connected in series with a light-emitting diode (LED) light source and a switching mechanism configured for non-contact actuation are disposed within an environmentally sealed chamber. A reflector is employed to maximize reflection of light emanating from the LED and a lens having an anti-reflective coating thereon associated with the LED opposite the reflector to enhance the light output and magnify the narrow beam of the LED. The switch employs an actuation mechanism exterior to the chamber to activate and deactivate the light.

Battery-powered light

A laser marking system for IC packages including a tray input shuttle assembly and a tray transport borne by a transport actuator for moving a tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith a lift mechanism for raising and lowering the tray carrier relative to the transport so as to facilitate tray loading of the tray carrier from the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier to the output shuttle assembly.

Laser marking system for dice carried in trays and method of operation

A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.

Methods of forming a contact array in situ on a substrate

Electrical contact array for substrate assemblies

A method for dispensing, receiving, storing, testing or binning packaged integrated circuit devices using at least one vertically oriented, removable, tubular magazine disposed above a controllably driven, rod-like indexing element extending from a drive below the magazine. A magazine, with an associated indexing element and drive, is configurable as an individual magazine module. The indexing element, under power of the drive, raises or lowers a vertical stack of devices to a desired level adjacent the top of the magazine to dispense or receive an individual device from a feed mechanism, such as a pick-and-place mechanism. A number of magazine modules may be assembled in a multi-module array, which is particularly suitable for binning tested devices, with a sort category being directed to each magazine.

Vertical magazine method for integrated circuit device dispensing, receiving, storing, testing or binning

A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is marking chips associated with one track, chips associated with other tracks that have already been marked are replaced by unmarked chips. In this manner, the laser is continually being used to mark semiconductor chips without having to wait for unmarked chips to move to the marking location.

Method of efficiently laser marking singulated semiconductor devices

An apparatus for laser marking IC packages carried in trays includes a transport actuator extending from an input shuttle assembly to an output shuttle assembly. The laser marking apparatus further includes a tray transport movable on the transport actuator and configured to receive a cooperatively configured tray carrier. The input shuttle assembly is adapted to load a tray carrying unmarked IC packages onto the tray carrier from a stack of trays on the input shuttle assembly. A tray bearing unmarked IC packages may travel on the tray carrier borne by the tray transport to a laser marking station positioned above the transport actuator and having a single laser marking head traversing one mark field disposed within an enclosure. A first portion of the IC packages disposed in the tray that are positioned in the mark field may be laser marked after the tray is lifted into the enclosure by a rotational lift mechanism located proximate the laser marking station.

Apparatus and method using rotational indexing for laser marking IC packages carried in trays

A laser marking system for IC packages including a tray input shuttle assembly, a tray transport borne by a transport actuator for moving a cooperatively configured tray carrier carrying a tray of unmarked packaged ICs received from the tray input shuttle assembly to a tray output shuttle assembly over a transport actuator path extending under an open-bottomed enclosure of a laser marking station. The tray input shuttle assembly, laser marking station and tray output shuttle assembly each has associated therewith a sliding wedge-type lift mechanism for raising and lowering the tray carrier vertically with respect to the transport so as to facilitate tray loading of the tray carrier from a stack of trays on the tray input shuttle assembly, insertion and withdrawal of the tray carrier bearing a tray of packaged ICs for marking into and out of the marking station and unloading of a tray of marked packaged ICs from the tray carrier onto a stack of trays on the output shuttle assembly. The lift mechanisms and tray shuttle assemblies may each be driven by air cylinders. A method of operation of the laser marking system is also disclosed.

A self-aligning tray carrier for supporting a tray carrying a large group of ICs therein. The invention includes self-aligning, cooperative tray carrier and tray transport configurations to ensure precise, repeatable alignment of a tray carrier with an underlying tray transport through gravity alone when a tray carrier which has been raised off the transport is again lowered into supporting contact therewith. Another, optional, feature of the mutually cooperative configurations of the tray carrier and tray transport permits the tilting of the tray carrier while still supported on the transport so as to effect precise alignment of IC packages carried in rectangular recesses on a tray on the tray carrier with respect to common alignment points (i.e., the same corner of each tray recess) to facilitate repeatability of the IC package surface location being marked on each IC package borne by the tray. Such alignment may be further enhanced by vibration or tapping of the tray carrier while in a tilted orientation. A lift mechanism for lifting the tray carrier above the tray transport is also disclosed.

Growing community of inventors

Nampa, ID, United States of America

Robert L Canella