Motorola Corporation

Robert L Benenati

Branko L Avanic

Robert E Stengel

James E Mitzlaff

Scott David Beutler

Vernon L Brown

Mike M Albert

Robert G Kinsman

Thomas F Kneisel

Wayne K Moy

Joseph Desjardins

An integrated switch (100) includes a first input port (102), a second input port (112) and an output port (106). The integrated switch (100) comprises a first electronically-tunable integrated capacitor (104) having a control line (108) for selectively coupling the first input port (102) to the output port (106). The switch (100) also includes a second electronically-tunable integrated capacitor (110) having a control line (108) for selectively coupling the second input port (112) to the output port (106).

Electronically tunable capacitor switch

An integrated tunable resonator (100) includes a common semiconductor carrier (110). Formed on the common semiconductor carrier (110) is an integrated voltage variable capacitor (104). A bulk acoustic wave resonator is formed on the common semiconductor carrier (110) and coupled to the voltage variable capacitor (104). In one aspect of the present invention, a thin film resonator (106) is coupled to the voltage variable capacitor (104) both of which are formed on a common semiconductor substrate (110). The combination of these three elements provide for a tunable integrated resonator (100). In another aspect of the present invention, a surface acoustic wave resonator (522), formed on a common semiconductor carrier (514), is coupled to a voltage variable capacitor (520) in order to provide a tunable resonator (500).

Integrated tunable resonators for use in oscillators and filters

A leadless chip carrier for RF power transistors or the like is disclosed which includes a body of insulating material having two major surfaces and side walls joining the major surfaces. In a first embodiment, a pattern of conductive pads is deposited on one major surface. A pattern of conductive contact areas is deposited on the other major surface and distributed interconnecting portions of conductive material are deposited to connect the pads to the respective contact areas. In a second embodiment, larger pads and contact areas are provided on a beryllia substrate to provide a leadless chip carrier for RF transistors capable of handling 8 watts. In a third embodiment, a single slot is made conductive to provide the distributed interconnecting portion for one terminal, while in a fourth embodiment, the slot is changed to a plurality of small, tungsten-filled through holes to provide a virtually hermetically sealed leadless chip carrier for RF power transistors.

Leadless chip carrier for RF power transistors or the like

An electrical battery is provided which includes a current sensing resistor situated in series with a plurality of battery cells located within a housing. The respective ends of the plurality of cells are coupled to positive and negative contacts on an external surface of the battery. The respective ends of the current sensing resistor are coupled to first and second sensing contacts on the external surface of the battery. A battery structure is thus provided which is capable of supplying electrical energy while permitting sensing of the magnitude of electrical current drawn from the battery.

Electrical battery including apparatus for current sensing

Transmission line filter adapted to respond to a predetermined frequency, having a resonator conducting layer with dielectric material on opposite sides thereof and a ground plane conducting layer on the outside surfaces of the dielectric material. The filter may be of the stripline or microstrip type having a resonator constructed so that it tends to operate at a frequency different from the desired frequency, and which is not accessible for trimming after the filter is constructed. The ground plane layer is accessible so that a portion thereof can be removed after the filter is constructed to change the electrical parameters of the line formed by the resonator and the ground plane layer to change the response frequency of the filter. Alternatively, conducting material can be added to an opening in the ground plane conducting layer to change the response frequency of the filter. The ground plane layer can be removed by a sand blast, laser beam or other means, and can be added by the use of conductive paint, to trim the frequency of the filter after it is constructed.

Growing community of inventors

Tamarac, FL, United States of America

Robert L Benenati