Ppg Industries Ohio, Inc.

Robert L Auger

Stuart Damon Hellring

Daniel E Rardon

Michael Allen Mayo

Yuzhuo Li

Suryadevara Vijayakumar Babu

Steven V Barancyk

John W Burgman

Colin P McCann

Satish Narayanan

This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.

Silica and silica-based slurry

Disclosed are compositions comprised of (a)a polymer containing pendant and/or functional groups selected from the group consisting of carbamate, urethane and/or amide functional groups; and (b) a rheology modifier comprising the reaction product of an amine and an isocyanate; and, optionally, a polymer which is different from the polymer (a) which contains carbamate, urethane and/or amide functional groups. Also disclosed are curable compositions comprised of the compositions described above which further comprise (c) a curing agent having functional groups reactive with the functional groups of the polymer (a). The curable compositions are useful for a variety of applications such as adhesives, sealants and surface coatings where the presence of a carbamate, urethane and/or amide functional polymer in conjunction with the rheology modifier provides improved thixotropy and superior sag resistance.

Compositions containing rheology modifiers with functional

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Pittsburgh, PA, United States of America

Robert L Auger