Varian Associates, Inc.

Other

Novellus Systems Incorporated

Robert L Anderson

John C Helmer

Edward J Seppi

Edward G Shapiro

Kwok Fai Lai

Ronald R Cochran

Vance E Hoffman, Jr

Young H Park

Richard E Demaray

A magentron sputtering apparatus includes a rotatable magnet which is either concave or convex. For one magnet structure, at least a portion of the centerline of the magnet lies along a curve defined by ##EQU1## where .xi.(r) is a preselected erosion profile. When stationary, the magnet generates a localized magnetic field of approximately constant width. In operation, when the magnet is rotated, it generates the preselected erosion profile in the target. The preselected erosion profile may be constant.

Sputtering apparatus with a rotating magnet array having a geometry for

Disclosed is a low cost computer tomographic (CT) scanner system specifically designed for radiation therapy treatment planning. A 512-channel photo-diode array with digitizing electronics converts image intensifier optical projection data directly into digital signals and has a dynamic range on the order of 100,000:1. The new simulator includes a rotating gantry, an X-ray generator with radiographic and fluoroscopic modes and a therapy style patient support assembly. Results on head and body size phantoms indicate that the simulator X-ray generator and image intensifier tube (IIT) with multi-channel photo-detector can produce photon statistic limited CT images. Software and hardware compensation methods are described which minimize geometrical distortions. Low noise, high input impedance electronics are employed which are phase-locked to the line frequency. A dual sample interval method is employed which effectively increases the range of the digital signal produced by the front-end electronics by three additional bits.

Computer tomography apparatus using image intensifier detector

A sputter magnetron ion source for producing an intense plasma in a cathode container which ionizes a high and substantial percentage of the sputter cathode material and means for extracting the ions of the cathode material in a beam. The ion extraction means is implemented by a magnetic field cusp configuration with a null region adjacent to the open end of the cathode container. Ions so produced are able to be directed at right angles to a substrate being coated for efficient via filling.

Physical vapor deposition employing ion extraction from a plasma

A magnetron sputter source providing a predetermined erosion distribution over the surface of a sputter target material is described. When the distribution is uniform, close coupling of the sputter target with the substrate to be coated is achieved, resulting in improved collection efficiency of the sputtered material by the wafer and improved film thickness uniformity. Elimination of erosion grooves provide for greater target consumption and longer target life. The cathode magnetron sputter source includes a rotating magnet assembly of a specific shape and a specific magnetic strength provides the desired erosion distribution. The target may be dished to improve uniformity near the periphery of the wafer. The resulting magnetron cathode is used for the deposition of thin films. Further applications of uniform magnetron erosion or preselected erosion include uniform or preselected magnetron sputter etch or reactive ion etch and concurrent deposition and etch.

Rotating sputtering apparatus for selected erosion

A source for sputtering from concentric rings on the surface of a single target is shown. The source comprises a rotatable closed-loop magnet having a plurality of curved sections of different average radius interconnected by a equal number of radial sections. In the preferred embodiment the curved sections each have a shape which results in a predetermined erosion profile in the associated concentric ring of the sputter target. The relative rate of sputtering from each of the rings may be controlled by adjusting the relative lengths of the curved portions of the closed-loop magnet.

Apparatus and method for multiple ring sputtering from a single target

A magnetron sputtering apparatus includes a rotatable magnet. At least a portion of the centerline of the magnet lies on a curve defined by ##EQU1## where .xi.(u) is a preselected erosion profile. When stationary, the magnet generates a localized magnetic field of approximately constant width. In operation, when the magnet is rotated, it generates the preselected erosion profile in the target. The preselected erosion profile may be constant.

Growing community of inventors

Palo Alto, CA, United States of America

Robert L Anderson