Epcos Ag

Snaptrack Incorporated

Rf360 Singapore Pte. Ltd.

Robert Koch

Maximilian Pitschi

Christian Bauer

Juergen Kiwitt

Jürgen Kiwitt

Hans Krueger

Wolfgang Pahl

Alois Stelzl

Franz Kubat

Juergen Portmann

Gerhard Kloska

Simone Colasanti

Jiman Yoon

Samir Tazarine

A filter circuit comprises a main operating unit (MU) arranged in the series signal line providing most of the filter function of the filter circuit. A micro acoustic last series resonator (RL) as a last element of the main operating unit in the series signal line is prone to excite a spurious mode that is damped with a final series capacitance (CE) circuited between the last element and the antenna terminal (AT).

Acoustic filter with improved reflectivity

Aspects of the disclosure relate to wireless communication, and high-frequency filters with resonators. One example is a frequency band filter circuit having a split resonator. The split resonator comprises a resonator including a first section of a shared input busbar, a first section of a shared output busbar, and an electrode structure between the first section of the shared input busbar and the first section of the shared output busbar, the electrode structure configured for a resonance. The split resonator also comprises a detuned resonator. The detuned resonator includes a second section of the shared input busbar, a second section of the shared output busbar, and a detuned electrode structure between the second section of the shared input busbar and the second section of the shared output busbar, the detuned electrode structure configured for a detuned resonance different from the resonance.

Electroacoustic filter including split resonator with detuning

A circuit arrangement can be used for adapting the electroacoustic properties of an electroacoustic component. The circuit arrangement includes a first conductor loop and a further element. The first conductor loop includes a main loop and a negative feedback loop. The negative feedback loop has a sense of curvature that is opposite to a sense of curvature of the main loop. The negative feedback loop compensates for a coupling between the main loop and the further element.

Circuit arrangement

A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented. The electrical and mechanical connection between the two wafers is accomplished with frame structures and pillars, the partial structures of which, distributed between two wafers, are wafer-bonded with the aid of connecting layers.

Wafer-level package and method for production thereof

An RF component can have a reduced electromagnetic internal coupling and may be suitable for miniaturization as a result. The component includes a micro acoustic filter of ladder-type design in a housing and a double coil having a first coil segment and a second coil segment. The two coil segments are oriented in opposite directions. The two coil segments are arranged without crossover in one layer and the double coil is arranged in proximity to a parallel branch resonator of the ladder-type filter structure.

RF component with reduced coupling and suitable for miniaturization

A stable electrical component includes a carrier substrate and a chip () mounted thereon. The component has a reactance element and a supporting element, which are at least partly arranged between the carrier substrate and the chip. The reactance element is at least partly realized by means of at least one conductor track. The reactance element includes a coil, a capacitor or a transmission line.

Electrical Component

A substrate with an HF-compatible line arranged in this substrate will be proposed that is formed similar to a tri-plate strip line in which, however, at least one of the ground planes has a slot that follows the profile of the signal line arranged between two ground planes. With the aid of this slot, the capacitive constant of the line can be lowered and thus the impedance of the line can be increased.

Growing community of inventors

Munich, Germany

Robert Koch