Google Inc.

Applied Materials, Inc.

Waymo LLC

Robert Kim

Ganesh Balasubramanian

Amit Kumar Bansal

Dale Robert Du Bois

Tuan Anh Nguyen

Juan Carlos Rocha-Alvarez

Deenesh Padhi

Ramprakash Sankarakrishnan

Mohamad A Ayoub

David G Duff

Mark A Fodor

Kenneth Ryan Loo

Hang Yu

Juan Carlos Rocha

Chiu Chan

Kirby Hane Floyd

Siu Fai Cheng

Binh Nguyen

Ray Reddy

Felix Jose Alvarez Rivera

Daniel Lynn Larner

Thomas Daniel

Alex Khaykin

Dale Du Bois

Embodiments of the invention contemplate a shadow ring that provides increased or decreased and more uniform deposition on the edge of a wafer. By removing material from the top and/or bottom surfaces of the shadow ring, increased edge deposition and bevel coverage can be realized. In one embodiment, the material on the bottom surface is reduced by providing a recessed slot on the bottom surface. By increasing the amount of material of the shadow ring, the edge deposition and bevel coverage is reduced. Another approach to adjusting the deposition at the edge of the wafer includes increasing or decreasing the inner diameter of the shadow ring. The material forming the shadow ring may also be varied to change the amount of deposition at the edge of the wafer.

Shadow ring for modifying wafer edge and bevel deposition

The present invention provides a computer-implemented method to order ahead with a mobile device. A user network device receives an input of an order from a user; communicates the order to a merchant network device; receives a preparation time for one or more components of the order; determines a location of the user device; monitors a projected time of arrival at the merchant based on the location of the user device; compares the projected time of arrival with the component preparation time; and notifies the merchant to begin preparation of at least one of the components in response to a determination that the projected time of arrival equals the preparation time of one or more components.

Ordering ahead with a mobile device

A method and apparatus for processing a substrate are provided. The apparatus includes a pedestal and rotation member, both of which are moveably disposed within a processing chamber. The rotation member is adapted to rotate a substrate disposed in the chamber. The substrate may be supported by an edge ring during processing. The edge ring may selectively engage either the pedestal or the rotation member. In one embodiment, the edge ring engages the pedestal during a deposition process and the edge ring engages the rotation member during rotation of the substrate. The rotation of the substrate during processing may be discrete or continuous.

Wafer rotation in a semiconductor chamber

Aspects of the present disclosure relate to an apparatus providing a first component having a circular opening with an interior chamfered edge and a second component positioned within the circular opening. The apparatus also provides a magnetic feature at a circular bottom surface of the first component, where the magnetic feature provides a magnetic pull force in a first direction to secure the second component within the circular opening. The second component is configured to break away from the circular opening when a contact force to the breakaway component causes a force in a second direction opposite of the first direction and greater than the magnetic pull force.

Variable magnetic break-away mounting mechanism

Aspects of the present disclosure relate to an apparatus providing a first component having a circular opening with an interior chaffered edge and a second component positioned within the circular opening. The apparatus also provides a magnetic feature at a circular bottom surface of the first component, where the magnetic feature provides a magnetic pull force in a first direction to secure the second component within the circular opening. The second component is configured to break away from the circular opening when a contact force to the breakaway component causes a force in a second direction opposite of the first direction and greater than the magnetic pull force.

Systems for mounting a windshield to a vehicle are described. In one example, an apparatus configured to a mount a windshield to a vehicle is disclosed. The apparatus includes a foam configured to be positioned between the windshield and a frame of the vehicle along at least three sides of an interior perimeter of the windshield. The apparatus also includes one or more rigid components configured to compress the foam when the windshield is deformed. The one or more rigid components may be positioned at least partially within the foam. The apparatus further includes an attachment component configured to attach the foam to the frame of the vehicle.

Systems for mounting a vehicle windshield

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Mountain View, CA, United States of America

Robert Kim