Jds Uniphase Corporation

Lucent Technologies Inc.

Robert K Wolf

Hui Fu

William K Hogan

Erji Mao

Craig Young

Chris Hart

Heino Bukkems

Eric A Craig

Wenhong Qin

Anthony T Yesenofski

The invention relates to a compact transmitter optical sub-assembly (OSA), which can be used in small form factor optical transceivers. To limit back reflections from entering the laser cavity, the laser is disposed on a silicon optical bench (SiOB) at an acute angle to the longitudinal axis of the OSA. A portion of the light from the laser cavity passes through the back end of the laser cavity for measuring by a monitor photodiode. A rear beam steering lens redirects the portion of light into a v-groove in the SiOB and off of a reflective surface formed in the end thereof to the monitor photodiode, which is positioned face down over the v-groove.

Compact optical sub-assembly

An optical transmitter includes a header, a hybrid subassembly, a laser mounted on the header, a laser driver mounted on the hybrid subassembly, and an air trench formed between the header and the hybrid subassembly.

Air trench that limits thermal coupling between laser and laser driver

A method of positioning a heat generating component on a header to enhance heat sinking characteristics includes positioning the header on a first pedestal, wherein the first pedestal and the header are bounded by an air trench having a vertical surface, and positioning the heat generating component only in areas on the header having an associated heat dissipation conical region extending from the heat generating component downward through the first pedestal at an angle that satisfies Fourier's Law of Heat Conduction, wherein the conical region does not intersect the vertical surface of the air trench.

Method for improving heat dissipation in optical transmitter

A Faraday cage enclosing an optical device extends between a metalized plate and an upper enclosure. The upper enclosure is vertically spaced from the metalized plate. The Faraday cage includes one or more ceramic wall portions that extend from the metalized plate to the upper enclosure and limit the passage of EMI through the ceramic wall portions. The ceramic wall portions include a plurality of laminated ceramic layers, each one of the laminated ceramic layers extending substantially parallel to the metalized plate, and a plurality of vias extending substantially perpendicular to the metalized plate through the laminated ceramic layers, each one of the plurality of vias extending substantially from the metalized plate to the upper enclosure. The plurality of vias are configured to form a pattern that limits the passage of EMI through the vias, wherein the metalized plate, the upper enclosure, and the ceramic wall portions define a Faraday cage that surrounds the optical device.

Faraday cage and ceramic walls for shielding EMI

An optical isolator includes a first magnetic polar source having a first magnet axis, a second magnetic polar source having a second magnet axis parallel to the first magnet axis, and an optical element between the first and second magnetic polar sources, and having a length along the first magnet axis that is less than a length of the first magnetic polar source along the first magnet axis. The optical element has a central axis that is tilted with respect to the second magnet axis.

Optical isolator with improved mounting characteristics

A reconfigurable laser header assembly, wherein either an n-doped laser substrate structure or a p-doped laser substrate structure can be properly biased, includes a header coupled to a modulated electric (AC) current source, a DC positive bias electric current source, and a DC negative electric current source. A laser is mounted relative to the header, the laser includes a base electric contact and a laser electric contact. An electrical conductor on the header includes first and second metalized regions in electrical connection with the base electric contact, wherein different ones of the modulated electric current source, the bias electric current source, and the DC negative electric current source can be electrically connected to the first metalized region, the second metalized region, and the laser electric contact to properly bias the laser regardless of whether the laser is an n-doped laser substrate structure or a p-doped laser substrate structure.

Reconfigurable laser header

The invention is a transceiver package with reduced overall width and optical pitch. Separate circuit boards are provided for the laser with its associated circuitry and the photodetector with its associated circuitry. The boards are mounted to the sidewalls of the package housing so that they are essentially perpendicular to the base of the package and to the major surface of the mother board.

Growing community of inventors

Fleetwood, PA, United States of America

Robert K Wolf