Northern Telecom Limited

Robert K Surridge

Jingming Xu

To mount a semiconductor i.c. die on a support substrate the upper surface of the die is provided with electrically conductive bumps all of which are the same height. The bumps are provided on the ground connection pads on the upper surface of the die. The conductive pads on the die including the ground connection pads are connected to corresponding contacts on the upper surface of the substrate on which the die is mounted. Additionally, a thermally conductive, electrically conductive slug overlies the die and is mounted on and bonded to the bumps. The slug provides required heat removal from the die and also provides necessary ground connection to circuitry within the die.

Chip mounting scheme

A Metal-Semiconductor-Metal (MSM) photodetector comprises a semiconductor substrate, a semiconductor barrier layer on the substrate, a thin semiconductor active layer on the barrier layer, and at least two electrical contacts to the active layer. The barrier layer prevents carriers generated deep in the substrate from reaching the contacts. As it is the delayed detection of these carriers which limits the useful operating speed or bandwidth of conventional MSM photodetectors, the MSM photodetector according to the invention is capable of higher speed operation than conventional MSM photodetectors.

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Kanata, Canada

Robert K Surridge