Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Visteon Global Tech., Inc

Robert Joseph Gordon

Robert Edward Belke

Andrew Zachary Glovatsky

Lakhi Nandlal Goenka

Delin Li

Achyuta Achari

Brenda Joyce Nation

Thomas Bernd Krautheim

Vivek Amir Jairazbhoy

Mohan R Paruchuri

Dongkai Shangguan

Michael George Todd

George Albert Garfinkel

Richard Keith McMillan

Paul Zoratti

Vladimir Stoica

Charles Still

Timothy Arthur Tiernan

Samuel G Rahaim

A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

Circuit board with air-bridge

A sensor cover is disclosed for camouflaging a high frequency sensor, including for example, a radar sensor. The sensor cover includes a substrate having a non-planar surface with non-signal transmitting regions and signal transmitting regions. A metal layer is disposed on each of the non-signal transmitting regions. Further, each of the non-signal transmitting regions is separated by one of the signal transmitting regions. The method of constructing such a sensor cover is also disclosed.

Sensor cover and method of construction thereof

A method for making a multi-layer circuit board having apertures which may be selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material Each of the apertures selectively receives electrically conductive material

Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material

A method for producing a circuit assembly having a polymeric member upon which conductors, such as conductors , may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.

Circuit assembly and a method for making the same

A solder composition and a method for producing such a solder composition is provide. The solder composition is substantially &ldquo;lead-free&rdquo;, has a relatively long shelf life, and has a desirable melting temperature. Particularly, the solder composition contains tin and zinc with substantially all of the exposed zinc constituents or phases being covered by a relatively thin layer of tin. The formed solder composition may be operatively used with a mildly activated &ldquo;no-clean&rdquo; rosin flux.

Solder composition and a method for making the same

A method for making a multi-layer electronic circuit board having electroplated apertures which may be selectively and electrically isolated from an electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material

Circuit board and a method for making the same

A method for making multi-layer electronic circuit board including a pre-circuit assembly and a ground layer which are automatically aligned and bonded together by use of solder material or deposits

Method for making an electrical circuit board

Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more conductors on the board by use of solder material subject to one or more gas trapping through-hole vias, comprising: (a) creating at least one vent channel below the top plane of the printed circuit and extending from a location at or closely adjacent to one of said vias to a location essentially near a periphery of solder material to be placed thereover; (b) planting a deposit of solder material between the component and pad; (c) bringing the component, solder material and pad together to form an assembly; and (d) heating the assembly to momentarily reflow the solder material in place without shifting, skewing, or tilting of the component, any trapped air in said one vias being allowed to expand and migrate away through the channel to at least the periphery of the pad.

Reflow soldering to mounting pads with vent channels to avoid skewing

A method and apparatus for forming a rigid circuit board uses a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has two rollers used to form the bend region to a predetermined shape. When the circuit is cooled, the circuit board again becomes rigid in its predetermined shape.

Growing community of inventors

Livonia, MI, United States of America

Robert Joseph Gordon