Indiana Integrated Circuits, LLC

Science Applications International Corporation

Robert Joseph Engelhardt, Jr

Jason M Kulick

Tian Lu

John Philip Timler

Carlos J Ortega

A substrate assembly includes a printed circuit (PC) substrate, first and second microchips, components or substrates mounted on a surface of the PC substrate, and a projection extending in spaced relation to the surface of the PC substrate. In one example, the projection extends between (i) a downward facing surface and/or an edge of a side facing surface proximate the downward facing surface of the first microchip, component or substrate and (ii) an upward facing surface and/or an edge of a side facing surface proximate the upward facing surface of the first microchip, component or substrate. The first and second microchips, components or substrates may be mounted on different levels of the PC substrate surface. In another example, the projection extends between a upward and/or side facing surface of a first microchip, component or substrate and a slot or cavity in a second microchip, component or substrate.

Edge interconnects for use with circuit boards and integrated circuits

A substrate assembly includes at least one printed circuit (PC) substrate. Each PC substrate includes a PC top surface and a PC bottom surface spaced from each other and an edge that runs at least partially about a periphery of the PC substrate between the PC top surface and the PC bottom surface. The edge includes or defines on a facet or edge surface of the edge at least one projection that extends transverse or normal to the facet or edge surface. The projection includes a projection top surface and a projection bottom surface spaced from each other and the projection can include or be made of conductive material.

Growing community of inventors

Broomfield, CO, United States of America

Robert Joseph Engelhardt, Jr