Delphi Technologies, Inc.

Robert Joseph Cochrane

Haim Feigenbaum

William R Crumly

Eric Dean Jensen

Pete Henry Hudson

A chip scale package includes a mandrel built flexible circuit having a circuit trace on a first surface and an aperture extending therethrough. The chip scale package includes a pad covering the aperture on the first surface of the flexible circuit and a raised interconnection member extending outwardly from the pad. The chip scale package also includes a chip secured to a second surface of the flexible circuit, such that the chip is electrically connected to the pad.

Growing community of inventors

Riverside, CA, United States of America

Robert Joseph Cochrane