Nordson Corporation

Dage Precision Industries, Inc.

Xyztec Bv

D{dot Over (a)}ge Precision Industries, Ltd.

Robert John Sykes

Martin Bugg

David T Lilley

Benjamin Kingsley Stuart Peecock

Alan Norman Wiltshire

Benjamin Kingsley Stuart Pcecock

William Thomas Luke Walker

Steven Jeffrey Humc Ainsworth

Andrew Glyn Richard Cartwright

David Terence Lilley

Benjamin K S Peecock

Alan N Wiltshire

Aubert DV Dupont

A method of cleaning solder from the jaws of a solder ball test device including the steps of heating a gas to a temperature above the melting temperature of the solder and directing the heated has over the jaws of a solder ball test device to remove solder from the jaws, and an apparatus for carrying out the method.

Solder cleaning system

A testing apparatus for testing the strength of a material connection to a substrate. A drive mechanism couples a test tool mount to a main body and allows for relative movement between the test tool mount and the main body in an axial direction. A biasing element is coupled between the main body and the test tool mount, that, in operation, biases the test tool mount relative to the main body in an axial direction. The biasing element is switchable between a first state in which the test tool mount is biased either toward or away from the substrate and another state in which the biasing element provides one of: no biasing force to the test tool mount toward or away from the substrate, or a biasing force in a direction opposite to the direction of bias applied in the first state.

Bond strength tester with switchable backlash control

A bond strength testing apparatus comprising a main body, a test tool mount for holding a test tool, and an axial drive mechanism including a screw and nut assembly. The drive mechanism couples the test tool mount to the main body and allows for relative movement between the test tool mount and the main body in an axial direction. A backlash control element is coupled to the main body and the test tool mount, and, in operation, biases the test tool mount relative to the main body in an axial direction. The backlash control element is switchable between a first state in which the test tool mount is biased in a first axial direction by the backlash control element, and a second state in which either the test tool mount is biased in a second axial direction by backlash control element, or the backlash control element applies no biasing force to test tool mount. The apparatus can be automated to apply the appropriate backlash control for a particular, selected test type.

A tensile testing machine has a jaw which includes a unitary 'H' section member having a cross piece and two uprights. The cross piece is mounted to a cantilever beam which is supported on the test machine and has force measuring elements. A pneumatic actuator applies tensile forces to the first ends of the uprights via strands to urge the first ends apart. When first ends of the uprights are urged apart, their oppositely disposed second ends are urged together to grip a sample deposit to be pulled off a substrate in a tensile test. In use, the jaws can be moved at speed, in the order of 500 mm/s to pull the deposit off of the substrate. The force required to pull the deposit off the substrate in this tensile test is measured by the force measuring elements on the beam.

Tensile test device and method for testing deposits on electronic substrates

A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate.

Clamping mechanism for shear testing apparatus

A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate. Strain gauges associated with the shear test tool provide signals to an electric circuit indicating the strength of attachment between the bond and the substrate.

Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element () on which is provided a piezo-electric crystal () in the direct shear load path. The crystal () may have a shield (). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.

Test device

A tensile testing machine has a jaw which includes a unitary 'H' section member having a cross piece and two uprights. The cross piece is mounted to a cantilever beam which is supported on said test machine and has force measuring elements. A pneumatic actuator applies tensile forces to the first ends of the jaw via strands to urge the first ends apart. When first ends of the uprights are urged apart, their oppositely disposed second ends are urged together to grip a sample deposit to be pulled off a substrate in a tensile test. In use, the jaws can be moved at speed, in the order of 500 mm/s to pull the deposit off of the substrate. The force required to pull the deposit off the substrate in this tensile test is measured by the force measuring elements on the beam.

A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces.

High speed pull test device and method

Shear test device

A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, in the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.

Apparatus and method for determining failure mode in a shear or pull test device

A test apparatus for applying shear loads to a deposit on a substrate comprises a cantilevered shear tool () having a tip () for contact with the deposit, and a back face having a piezo-electric crystal thereon. In use, the back face is subject to a compressive force, as well as other forces, and a corresponding electrical output from said crystal which is proportional to those forces. In one embodiment, the portion of the shear tool which contacts the deposit is offset rearwardly from the front face of the shear tool to improve the accuracy of the signal produced by the piezo-electric crystal. The apparatus is useful in testing the strength of bonds between deposits and substrates typically found in semiconductor devices.

Shear test apparatus and method

A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, hi the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.

Shear test apparatus for gold and solder balls of a semi-conductor substrate comprises a support element () on which is provided a piezo electric crystal () in the direct shear load path. The crystal () may have a shield (). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.

A device () for shear testing of very small protrusions of an electrical semi-conductor device includes a sensor () for detecting surface contact of a shear test tool (). The lateral shear force transducer is also used to detect scrubbing forces as the tool is reciprocated on the substrate, so as to give accurate surface contact sensing of non-rigid substrates. After contact sensing, the test tool is stepped back to ensure the shear test is performed without dragging of the tool on the substrate.

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Essex, United Kingdom

Robert John Sykes