The Whitaker Corporation

Veoneer Us, Inc.

Tyco Electronics Corporation

Robert John Sletten

Bernhard Alphonso Ziegner

Angelos Alexanian

Bernard DeMersseman

Scott Bermingham Doyle

Noyan Kinayman

Majid Ahmadloo

May Cho

Nitin Jain

Stephen Robert Brown

Patrick Holmes

Aaron Cahill

Walter Leo Storkus

Eric Andrew Soshea

Steve Robert Brown

RADAR or other sensor assemblies/modules, particularly those for vehicles, along with related manufacturing/assembly methods. In some embodiments, the assembly may comprise a housing and a printed circuit board. The printed circuit board may comprise a first side and a second side opposite the first side and may further comprise one or more integrated circuits positioned on the first side of the printed circuit board. One or more antennas may be operably coupled with the integrated circuit. A flexible radome, such as a thermoplastic wrapper, may enclose the assembly and may provide the means for binding the printed circuit board to the housing.

Automotive radar sensor packaging methods and related assemblies

A scanning assembly for a detection system for a vehicle has a scanning fixture including a first mirror. The scanning fixture is attached to a first pivot. A reflective surface of the first mirror provides a first field of view between the detection system and a surrounding environment. A central member has a first end attached to the first pivot and a second end attached to a second pivot to couple the first pivot to the second pivot. A base is configured to attach the scanning assembly to the vehicle. The base is further attached to the second pivot. The scanning fixture is coupled to the base exclusively through attachment of the first pivot to the second pivot via the central member, the second pivot in turn being attached to the base.

Scanning assembly for a detection system

Antenna assemblies for vehicles, such as RADAR sensor antenna assemblies. In some embodiments, the assembly may comprise an antenna block defining an array of waveguide grooves on a first side of the antenna block. A slotted layer comprising a plurality of slots may be coupled with the antenna block with the slots at least partially aligned with the waveguide grooves of the antenna block. An adhesive layer may be positioned in between the antenna block and the slotted layer.

Waveguide sensor assemblies and related methods

Flexible multilayer microwave or mm-wave circuits and sensors are provided having at least (a) a first metallization layer, at least a portion of the first metallization layer being adapted for operation at a frequency ranging from 20 GHz to 100 GHz; (b) a second metallization layer, at least a portion of the second metallization layer being adapted for operation as a ground plane; (c) a dielectric substrate layer, the dielectric substrate layer being disposed between the first and second metallization layers; and (d) a plurality of conductive vias extending through the dielectric substrate layer and electrically connecting portions of the first and second metallization layers.

Film-based microwave and millimeter-wave circuits and sensors

A surface-mountable mm-wave signal source is provided. The surface-mountable mm-wave signal source comprises: a conductive metal base; a mm-wave signal source disposed over an upper portion of the metal base; a first radio frequency transmission line carrying a quasi-TEM signal from the mm-wave signal source, which is disposed over an upper portion of the metal base and proximate the signal source; a first mode transformer at least partially integrated into the upper portion of the metal base to convert the quasi-TEM signal carried by the planar transmission line into a rectangular waveguide mode signal; a waveguide well having upper and lower ends disposed within the base for carrying the rectangular waveguide mode signal from an upper portion of the base to a lower portion of the base; and a second mode transformer at least partially integrated into the lower portion of the base to convert the rectangular waveguide mode signal to a quasi-TEM signal within a second radio frequency transmission line. The mm-wave signal source preferably operates in a frequency range of from 35 to 94 GHz, more preferably a frequency range of 70 to 80 GHz.

Surface-mounted millimeter wave signal source with ridged microstrip to waveguide transition

An antenna has a relatively thick primary dielectric between a ground plane and a conducting radiating element being fed by a conducting transmission line, first and second thin dielectrics on opposite sides of the primary dielectric, the relatively thick primary dielectric having a relatively lower dielectric constant than that of at least the second thin dielectric to increase the bandwidth transmission capability of the transmission line for a given impedance, the second thin dielectric couples substantially less power than is coupled with the primary dielectric and the second thin dielectric is of relatively higher dielectric constant promoting surface wave coupling and reduction of wave losses.

Low cost reduced-loss printed patch planar array antenna

A packaged integrated circuit (20, 20a, 20b) which includes at least one waveguide port (44, 44a, 44b) and at least one interconnect (26, 26a, 26b) which is electrically connected to an integrated circuit (30, 30a, 30b).

Millimeter wave module with an interconnect from an interior cavity

An IC package appropriate for microwave devices, integrated circuits, multichip modules, and hybrid circuit assemblies and power devices comprises an outer interconnect (2) and an inner interconnect (3). Lead lines (8) on an outer interconnect (2) are in electric engagement with respective access lines (13) on an inner interconnect (3). Contacts (21) of an IC are electrically interconnected with the access lines (13) on the inner interconnect (3). A package according to the teachings of the present invention provides for efficient heat dissipation from the package interior and an efficient electrical transition from the interior of a package.

Growing community of inventors

Bow, NH, United States of America

Robert John Sletten