Nexperia B.v.

Robert James Montgomery

Ricardo Lagmay Yandoc

Adam Thomas Rosillo

This disclosure relates to a cascode HEMT semiconductor device including a lead frame, a die pad attached to the lead frame, and a HEMT die attached to the die pad. The HEMT die includes a HEMT source and a HEMT drain on a first side, and a HEMT gate on a second side. The device further includes a MOSFET die attached to the source of the HEMT die, and the MOSFET die includes a MOSFET source, a MOSFET gate and a MOSFET drain. The MOSFET drain is connected to the HEMT source, and the MOSFET source includes a MOSFET source clip. The MOSFET source clip includes a pillar so to connect the MOSFET source to the HEMT gate, and the connection between the MOSFET source to the HEMT gate is established by a conductive material.

Cascode semiconductor

This disclosure relates to a discrete semiconductor device and associated method of manufacture, the discrete semiconductor device includes: a high voltage depletion mode device die; and a low voltage enhancement mode device die connected in cascode configuration with the high voltage depletion mode device die. The high voltage depletion mode device includes a gate, source and drain terminals arranged on a first surface thereof and the gate source and drain terminals are inverted with respect to the low voltage enhancement mode device die and the low voltage device is arranged adjacent to the high voltage device.

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Nijmegen, Netherlands

Robert James Montgomery