General Electric Company

Lockheed Martin Corporation

Martin Marietta Corporation

Momentive Performance Materials Gmbh

Insulating Materials Incorporated

Robert J Wojnarowski

Charles W Eichelberger

Herbert S Cole

Raymond Albert Fillion

Michael Gdula

William P Kornrumpf

Thomas Bert Gorczyca

Ernest Wayne Balch

Wolfgang Daum

Stanton Earl Weaver, Jr

James Wilson Rose

Leonard Richard Douglas

Ertugrul Berkcan

Emad Andarawis Andarawis

Kenneth B Welles, Ii

Bernard Gorowitz

Theresa Ann Sitnik-Nieters

Kenneth Brakeley Welles

Eladio Clemente Delgado

Ronald Frank Kolc

Barry Scott Whitmore

Steven Francis LeBoeuf

William Edward Burdick, Jr

William Paul Minnear

John L Henkes

Jacob Charles Bortscheller

Evan Taylor Downey

Abraham Auerbach

Christopher James Kapusta

Richard J Saia

Lionel M Levinson

Ching-Yeu Wei

Stephen Daley Arthur

Charles Erklin Seeley

Charles Edward Baumgartner

Ahmed Elasser

William Andrew Hennessy

Charles S Korman

Constantine A Neugebauer

Yung S Liu

Glenn A Forman

Richard Alfred Beaupre

Charles E Thomas

Eric J Wildi

Michael C DeJule

Samantha Rao

Kyung W Paik

Rudolph A Dehn

Pamela King Benicewicz

Abasifreke Udo Ebong

David Francis Fobare

Walter M Marcinkiewicz

Nanette Gruber

C Scott Sealing

Richard H Coulter

Peter I Cohen

Amer A Hassan

John Erik Hershey

Mark Philip D'Evelyn

Venkat Subramaniam Venkataramani

Kevin Matthew Durocher

Kanakasabapathi Subramanian

Steven Jude Duclos

Jon Bennett Jansma

Samhita Dasgupta

Homer H Glascock, Ii

Vinayak Tilak

Richard Louis Frey

John H Lupinski

Thomas Francis McNulty

James Enrico Sabatini

Jeffrey Bernard Fortin

Raul Eduardo Ayala

Edward B Miller

Larry Burton Rowland

Steven Alfred Tysoe

Charles Adrian Becker

Clive W Reed

Wesley K Waldron

Charles Scott Sealing

Xiao-Dong Sun

David Cecil Hays

Ferenc Horkay

William D Ryckman

Richard O Carlson

Theodore R Haller

Scott E Cutler

Thomas M O'Loughlin

Richard Joseph Uriarte

Thomas P Wacker

Menahem Lowy

Anthony A Immorlica, Jr

Michael A Haase

Stanton E Weaver

Constantine A Neugebauer, Deceased

Barry S Whitmore

Xian An (Andrew) Cao

Thomas Bent Gorczyca

Theodore G Mihran

Haleh Ardebili

Monitoring systems, sensor nodes, and methods of operating a system for monitoring one or more operating conditions of a structure, are provided. An exemplary monitoring system includes one or more sensor nodes each including a power supply, a sensor configured to sense whether or not the power level of the power supply, and a communications interlace for communicating sensed operating conditions. The system also includes a controller in communication with the sensor nodes through a communication network to monitor the sensor nodes.

Self regulating power conditioner for energy harvesting applications

A distributed monitoring system for monitoring one or more operating conditions of a structure includes: one or more sensor nodes coupled to the structure, each sensor node including: a power supply adapted to scavenge energy directed at the power supply; a sensor operably coupled to the power supply for sensing one or more operating conditions of the structure in the environment; and a communications interface operably coupled to the power supply and the sensor for communicating the sensed operating conditions of the structure; a communication network operably coupled to the sensor nodes; one or more controllers operably coupled to the communication network for monitoring the sensor nodes; and an energy radiator positioned proximate the structure adapted to radiate energy at the power supplies of the sensor nodes.

Power aware techniques for energy harvesting remote sensor system

A semiconductor chip packaging structure is fabricated by using a dielectric film with two surfaces, and a power semiconductor chip with an active surface having contact pads. An adhesive layer is used to connect the first surface of the dielectric film and the active surface of the power semiconductor chip. A patterned electrically conductive layer is formed adjacent to the second surface of the film, extending through holes in the film to the contact pads.

Power semiconductor packaging method and structure

A piezoelectric planar composite apparatus to provide health monitoring of a structure and associated methods are provided. The piezoelectric planar composite apparatus includes a piezoelectric electric material layer, multiple electrodes positioned in electrical contact with the piezoelectric material layer, and multiple sets of electrode interconnect conductors each positioned in electrical contact with a different subset of the electrodes and positioned to form multiple complementary electrode patterns. Each of the complementary electrode patterns is positioned to form an electric field having an electric field axis oriented along a different physical axis from that of an electric field formed by at least one other of the complementary electrode patterns. The interconnect conductors can be distributed over several electrode interconnect conductor carrying layers to enhance formation of the different complementary electrode patterns.

Piezoelectric composite apparatus and related methods

The present invention is directed towards a source of ultraviolet energy, wherein the source is a UV-emitting LED. In an embodiment of the invention, the UV-LED is characterized by a base layer material including a substrate, a p-doped semiconductor material, a multiple quantum well, a n-doped semiconductor material, upon which base material a p-type metal resides and wherein the LED's are provided with a rounded mesa configuration. In a specific embodiment, the p-type metal is positioned upon a rounded mesa, such as a parabolic mesa, formed out of the base structure materials.

UV emitting LED having mesa structure

A broad band energy harvesting system to harvest energy from a structure and associated methods are provided. The system includes a structure carrying a plurality of environmentally produced vibration frequencies extending over a frequency range and an energy harvesting apparatus positioned in vibration receiving communication with the structure to harvest energy from the structure. Each energy harvesting apparatus includes broadly tuned energy harvesting generators having relatively low quality factor and corresponding relatively wide bandwidth. The energy harvesting generators collectively provide energy harvesting over multiple modes to thereby provide energy harvesting over a substantial portion of the frequency range. Each energy harvesting generator can include a cantilevered beam connected to a common backbone comprised of a resilient material configured to transfer energy between adjacent generators to further enhance energy harvesting.

Broad band energy harvesting system and related methods

A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.

Method of making devices for solid state thermal transfer and power generation

A system to monitor the health of a structure, health monitoring sensor nodes, program product, and associated methods, are provided. The system includes an array of health monitoring sensor nodes connected to or embedded within a structure to monitor the health of the structure. Each health monitoring sensor node includes sensor elements positioned to sense parameters of the structure and to provide data related to the parameters to a health monitoring sensor node interrogator. Each health monitoring sensor node includes a processor or other means to reduce raw sensor data to thereby reduce communication bandwidth requirements and data collisions, and can include memory or other storage for storing the reduced data and an antenna arrangement for providing the reduced data to the health monitoring sensor node interrogator.

System to monitor the health of a structure, sensor nodes, program product, and related methods

An etchant including a halogenated salt, such as Cryolite (NaAlF) or potassium tetrafluoro borate (KBF), is provided. The salt may be present in the etchant in an amount sufficient to etch a substrate and may have a melt temperature of greater than about 200 degrees Celsius. A method of wet etching may include contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the support layer may include aluminum oxide; or contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the etchant may include Cryolite (NaAlF), potassium tetrafluoro borate (KBF), or both; and etching at least a portion of the support layer. The method may provide a laminate produced by growing a crystal onto an aluminum oxide support layer, and chemically removing at least a portion of the support layer by wet etch. An electronic device, optical device or combined device including the laminate is provided.

Etchant, method of etching, laminate formed thereby, and device

A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.

Device for solid state thermal transfer and power generation

The present invention is directed towards a source of ultraviolet energy, wherein the source is a UV-emitting LED's. In an embodiment of the invention, the UV-LED's are characterized by a base layer material including a substrate, a p-doped semiconductor material, a multiple quantum well, a n-doped semiconductor material, upon which base material a p-type metal resides and wherein the base structure has a mesa configuration, which mesa configuration may be rounded on a boundary surface, or which may be non-rounded, such as a mesa having an upper boundary surface that is flat. In other words, the p-type metal resides upon a mesa formed out of the base structure materials. In a more specific embodiment, the UV-LED structure includes n-type metallization layer, passivation layers, and bond pads positioned at appropriate locations of the device. In a more specific embodiment, the p-type metal layer is encapsulated in the encapsulating layer.

Monolithic array for solid state ultraviolet light emitters

A system to monitor the health of a structure, sensor nodes, program product, and associated methods are provided. The system includes an array of health monitoring sensor nodes connected to or embedded within a structure to monitor the health of the structure. The health monitoring sensor nodes include sensor elements positioned to sense parameters of the structure and to provide data related to the parameters to a health monitoring sensor node data collector. The sensor nodes can each include an energy harvester to harvest energy to power the sensor node. The system also includes an energy distributing node positioned to provide energy to the sensor nodes, through the structure being monitored, to be harvested by energy harvester of the sensor nodes.

A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has one or more electrically conductive posts which extend through the one or more though holes aligned with the contact pads to electrically couple the conductive layer to the contact pads. In certain embodiments, one or more air gaps may be formed between the dielectric film and the active surface of the at least one power semiconductor chip. Methods for fabricating the semiconductor chip packaging structure are also disclosed.

The present invention provides an X-ray detector assembly and a fabrication method, where the X-ray detector assembly comprises a scintillator material disposed on a detector matrix array disposed on a detector substrate; an encapsulating coating disposed on the scintillator material; a moisture resistant cover disposed over the detector substrate and the encapsulating coating, and an adhesive material disposed between the detector substrate and the moisture resistant cover so as to form a moisture vapor barrier. The adhesive material is disposed so that it is not in contact with the encapsulating coating. The fabrication method of the X-ray detector assembly includes the steps of disposing the encapsulating coating on the scintillator material and a portion of the detector substrate and removing the encapsulating coating from the portion of the detector substrate.

Direct CsI scintillator coating for improved digital X-ray detector assembly longevity

A light source () includes a light emitting component (), such as a UV/blue light emitting diode or laser diode coated with a layer () of a phosphor material (). The phosphor material converts a portion of the light emitted by the light emitting component to light of a longer wavelength, such as yellow light. The thickness d of the layer varies across the light emitting component in relation to the intensity of light emitted by the light emitting component. This maintains a uniform color of the emission from the light source while minimizing the loss in light intensity (brightness) due to the presence of the phosphor.

LED cross-linkable phosphor coating

Growing community of inventors

Ballston Lake, NY, United States of America

Robert J Wojnarowski