Monsanto Company

Memc Electronic Materials, Inc.

Other

Robert J Walsh

Andrew Haingaertner

Henry Frank Erk

Thomas A Walsh

Dennis Buese

Kan-Yin Ng

Harold J Hileman

Mesh gap chair slats

Mesh gap slated seating folding chair back

Slated seating folding chair

A portable hockey or soccer goal that can be readily converted between a fully open configuration and a fully closed storage or transport configuration without requiring any assembly or disassembly and having a rear and side stabilizing assembly such that the goal has improved strength while still being collapsible into a compact carrying bag.

Sports goal with collapsible frame

An apparatus and process for chemical-mechanical polishing an edge of a semiconductor wafer using a heated polishing pad and a heated liquid chemical slurry. The apparatus includes a rotatable drum having a cylindric outer surface, a heatable mat positioned around the outer surface of the drum, and a polishing pad in generally parallel arrangement with the mat. A wafer holder, a container of liquid slurry, and a slurry delivery system are also included. The process includes the steps of heating a liquid slurry to an elevated temperature and applying heat to the polishing pad from an underside of the polishing pad to elevate the temperature of the polishing pad. A peripheral edge of a semiconductor wafer is engaged against a polishing side of the polishing pad, and a relative motion is effected between the wafer and the pad while simultaneously dispensing the heated slurry onto a region where the edge of the wafer engages the pad.

Apparatus and process for high temperature wafer edge polishing

Apparatus for shaping a polishing pad includes a pad shaping tool and a fixture for holding the pad shaping tool free of fixed connection to the fixture. The pad shaping tool has a pad shaping surface which engages a polishing surface of the polishing pad to shape that surface. The pad shaping surface is sized for engaging the polishing surface across it entire width. The fixture constrains the tool from movement about the center of rotation of the polishing pad and constrains the center of the tool from substantial radial movement with respect to the pad. A method for shaping the polishing pad is also disclosed.

Apparatus and method for shaping polishing pads

Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.

Semiconductor wafer polishing appartus and method

A wafer workpiece polishing temperature control method and apparatus are provided wherein wafers are mounted upon a rotatable pressure plate assembly positioned in rotatable contact with a turntable assembly supported polishing pad, the turntable assembly having internal fluid cooling means, the wafer polishing temperature control being achieved through responsive closed loop electromechanical means activated by variation of polishing pressure upon the wafers and the polishing pad.

Temperature control for wafer polishing

Apparatus and method for wax mounting of thin wafers such as slices of semiconductor silicon to a carrier for polishing wherein the carrier is heated after being coated with wax which is maintained in a sticky condition by the heated carrier. A chamber is utilized for enclosing the thin wafers on resilient supports with the sticky wax-coated, heated carrier disposed above them. The chamber has an air tight seal permitting it to be evacuated. After evacuation a pneumatic cylinder is utilized to press the carrier against the wafers, which adhere to the sticky wax coating. The chamber is vented then to atmospheric pressure, the wafers remaining mounted by the wax coating to the carrier for subsequent polishing. The method avoids entrapment of gas bubbles between wafers and carrier.

Method and apparatus for wax mounting of thin wafers for polishing

Apparatus for improving polished wafer flatness such as slices of semiconductor materials through mounting of the wafers onto a deformable thin disc carrier which is mounted through a resilient device to a rotable pressure plate, the combined mounting being rotably engageable with a rotable turntable supported polishing surface, the turntable having an axis of rotation to edge bow away from the mounted wafers. The carrier is deformed to a concave shape opening toward the bowed table; thus permitting the mounted wafers to achieve through rotation polishing, uniformly improved flatness.

Apparatus for improving flatness of polished wafers

Method for combined chemical-mechanical polishing of III - V semiconductor planar surfaces by applying a weak aqueous hydrochloric acid solution in combination with an aqueous source of chlorine to the surface to be polished while simultaneously mechanically polishing the surface.

Process for chemical-mechanical polishing of III-V semiconductor

Circular wafers of semiconductor (silicon) are chemically treated, e.g., etched, by supporting the wafers vertically by contacting their edges with annularly grooved drive rollers, immersing the supported wafers in a body of chemical medium (e.g., etchant solution) for treatment, and rotating the wafers by rotation of the drive rollers while the wafers are immersed in the body of medium to uniformly and precisely treat the surfaces of the wafers. Apparatus for effecting such precision etching includes an etchant tank, a wafer rack including the drive rollers which support the edges of the wafers in vertical face-to-face relationship, the rack being lowered into the etchant to immerse the wafers. Means is disclosed for rotating the drive rollers for rotation of the immersed wafers and provision is included for circulating the etchant for causing uniform flow thereof past the rotating wafers. A heat exchanger maintains the etchant substantially at a predetermined temperature.

Growing community of inventors

Ballwin, MO, United States of America

Robert J Walsh