Potters Industries Inc.

Avon Products, Inc.

Other

Occidental Chemical Corporation

Hooker Chemicals & Plastics Corporation

Robert J Teichmann

James F Walther

Linda J Mayer

Dennis A Cupolo

Andrew M Wasowicz

Harold E Pahlck

Mulhall Robert C

Ramona Cardona-Grajales

Robert H China

A method of forming a hollow metallic article, comprising the following steps: (a) applying a layer of base metal to a fusible alloy mandrel; (b) applying a layer of precious metal to the layer of base metal; (c) applying a third layer of a non-metallic protective coating to the layer of precious metal; and (d) melting out the fusible alloy mandrel. Hollow articles formed by this method are also disclosed.

Electroformed hollow jewelry

A unique multi-layered coating process that includes coating the base metal with a layer of strike copper, a subsequent layer of bright copper, a barrier layer of palladium or related element, and a thin surface layer of a precious metal such as gold. The bright copper layer is produced by a special acid copper bath.

Multiple layered article having a bright copper layer

Composite particles suitable as conductive filler for electrically conductive compositions which can be used as gaskets, caulking and plastics, for example. The compositions are, useful as EMI shielding and electrostatic charge dissipation materials. Methods of making and using the foregoing are also covered.

Galvanically compatible conductive filler and methods of making same

Composite particles designed as a filler for gaskets, caulking compounds and plastics in general. The unique properties are obtained by using a soft metal core galvanically similar to the metal the sealant will be in contact with. The oxide surface of the core metal is typically breached by a multitude of small hard semiconductive or conductive particles, thus making low particle-to-particle contact resistance through the body.

Galvanically compatible conductive filler useful for electromagnetic

Galvanically compatible conductive filler

A nickel particle plating system in which a multiplicity of minute nickel spheres are provided with a heavy copper coating and then a comparatively thin silver coating. The copper coating is at least about 20 percent by weight of the shpere, and the silver coating has a maximum thickness of about 15 percent of the sphere diameter. The coated spheres are deposited in a nonconductive matrix to form an electroconductive body in which the spheres may be placed along conductive paths.

Nickel particle plating system

A nickel particle plating system in which a multiplicity of minute nickel particles are provided with gold and silver coatings and are deposited in a nonconductive matrix to form an electro-conductive body in which the particles may be placed along conductive paths. The coatings are applied to the particles in a unique manner which enables the realization of a gold coating having a maximum thickness of about 5 percent of the maximum particle dimension and a silver coating having a maximum thickness of about 10 percent of the maximum particle dimension.

An electroplating bath for the high speed deposition of bright metallic tin utilizing tin fluoroborate and sulfuric acid as the electrolyte; wherein, in addition to certain other additives, the bath contains a perfluoroalkyl sulfonate wetting agent to promote anode corrosion. Brighteners used in the system include aromatic amines and aliphatic aldehydes. For certain purposes it may be advantageous to include boric acid as part of the electrolyte; and, in other instances, to use an aromatic sulfonic acid to enhance bath stability and brightness. The method for utilizing a bath containing tin fluoroborate in a sulfuric acid matrix containing these perfluoroalkyl sulfonate wetting agents is also described.

Process and composition for the electrodeposition of tin and tin alloys

Improved electroplating bath for depositing bright, metallic tin wherein divalent tin, in the form of stannous sulfate or fluoroborate, is present in conjunction with sulfuric or fluoroboric acid, brighteners including an aromatic amine and an aliphatic aldehyde, a polyalkylene ether surfactant, and an aromatic sulfonic acid to ensure bath stability as well as the requisite brightness. The divalent tin-containing electroplating bath may also be provided with copper or rhodium salts to achieve codeposition of tin with at least one of these alloying metals. The method of utilizing such divalent tin electroplating baths to plate substrates with bright metallic tin is also described and claimed.

Growing community of inventors

Towaco, NJ, United States of America

Robert J Teichmann