Qualitau, Inc.

Robert J Sylvia

Adalberto M Ramirez

Maurice C Evans

Jens Ullmann

Jose Ysaguirre

Peter P Cuevas

Robert M Sikora

Jacob Herschmann

Yongbum (Peter) Cuevas

Thomas G Bensing

A test socket assembly is for use in testing integrated circuits. A single piece socket is formed substantially of an insulating material and having a plurality of holes formed therein configured to receive a plurality of electrically conductive springs. Each hole of the single piece socket has therein a separate one of the electrically conductive springs. A test socket includes a plurality of pins configured to receive leads of an integrated circuit, the pins of the test socket extending into the plurality of holes of the single piece socket with each pin engaging a spring, wherein the single piece socket is positioned on a circuit board with the plurality of holes being in alignment with electrical contacts on the circuit board such that the plurality of springs are electrically interconnecting the contacts and the plurality of pins. The single -piece socket is comprised substantially of a high-temperature insulating material, such as ceramic.

High temperature ceramic socket configured to test packaged semiconductor devices

A strip-shaped package is provided that can accept a single die up to many dice. Conduction paths are printed (or otherwise integrally formed) thereon to the edge of the package, and a complementary socket may be provided that, in combination with the strip-shaped package, provides for electrical connection to test electronics without the use of package leads. The strip-shaped package may be made of ceramic or other temperature resistant material. The strip-shaped package may have at least one 'well' location in which the die or dice may be affixed to the strip-shaped package. The strip may have notches configured to function as separators between the individual die housings (and related integrally-formed conduction paths).

High temperature ceramic die package and DUT board socket

A socket for use in testing packaged integrated circuits having leads depending therefrom includes a first member for receiving the integrated circuit package and having a plurality of holes for receiving leads extending from the package. A second member has a plurality of wire contacts for engaging the leads, the first and second members being arranged to permit relative lateral translation thereof. A support frame includes a first portion which physically engages the first member and a second portion which physically engages the second member. A lever or handle is attached to the second portion and includes a cam surface for engaging a cam follower on the first portion for imparting relative lateral motion between the two members whereby the package leads physically engage wires of the second member.

High temperature open ended zero insertion force (ZIF) test socket

An anti-electrostatic discharge (ESD) tool for engaging electronic device under test (DUT) boards whereby ESD damage to the tested devices is prevented. The tool includes an aluminum support frame, guides on opposing edges of one side of the frame for slidably receiving a DUT board, and at least one electrical shorting connector extending from the frame and electrically connecting and shorting socket connectors and leads of electronic devices when the DUT board is inserted into the guides. The electrical shorting connector preferably comprises an array of fine wire brushes which have sufficient rigidity and flexibility for engaging solder points on the DUT board for the socket connectors.

Electrostatic discharge (ESD) tool for electronic device under test (DUT) boards

A socket for use in testing packaged integrated circuits having leads depending therefrom includes a first member for receiving the integrated circuit package and having a plurality of holes for receiving leads extending from the package. A second member has a plurality of wire contacts for engaging the leads, the first and second members being arranged to permit relative lateral translation thereof. A cam is provided for sliding the first member relative to the second member and moving leads extending through the holes in the first member into engagement with the contacts of the second member. A socket for dual in-line integrated circuit package (DIP) has two rows of holes in the first member, and two slots are provided in the second member each aligned with a row of holes. The wire contacts extend across each slot. For high temperature operation (greater than 250&deg; C.) the first and second members comprise anodized aluminum or a ceramic, and the wires comprise Monel or other high temperature material.

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Santa Clara, CA, United States of America

Robert J Sylvia