Ford Global Technolgoies, LLC

Ford Motor Company Limited

Robert J McCarthy

George Tom Calvas

Steven L Wall

Alexander Tzinares

A system for controlling a fuel injector in accordance with an injection control strategy for an engine includes programmable control logic to provide selectable threshold signals for comparator circuits and/or control logic configured to receive various control signals in the control circuit and determine one or more timing signals. The programmable control logic allows the drive circuit to be modified, without changing any hardware, to accommodate injectors having different characteristics and to change the pulse modulation strategy. The control logic that receives the control signals produces injection timing signals to allow enhanced monitoring and control over the fuel injection process.

System for controlling a fuel injector

A system for controlling a fuel injector in accordance with an injection control strategy for an engine includes programmable control logic to provide selectable threshold signals for comparator circuits and/or control logic configured to receive various control signals in the control circuit and determine one or more timing signals. The programmable control logic allows the drive circuit to be modified, without changing any hardware, to accommodate injectors having different characteristics and to change the pulse modulation strategy. The control logic that receives the control signals produces injection timing signals to allow enhanced monitoring and control over the fuel is injection process.

A system and method for dissipating thermal energy created by multiple electronic circuit boards packaged within a single housing and while in operation are disclosed. The system and method enhances heat convection and heat conduction across and through the housing. A heat conductive housing having a plurality of longitudinally extending fins for increasing the surface area of the housing and correspondingly increasing heat convection to the housing is utilized. Furthermore, the multiple electronic circuit boards are packaged such that a heat conductive path, defined by a thermally conductive material, is disposed between the plurality of electronic circuit boards. Finally, the heat conductive material is applied to the inner surface of the housing and between each of the electronic circuit boards. The present invention increases heat conduction of the thermal energy generated by the plurality of electronic circuit boards to the housing, thereby preventing circuit board damage.

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Grosse Pointe Woods, MI, United States of America

Robert J McCarthy